Senior SDE- Kernel Engineer, SSG
Amazon
Senior SDE- Kernel Engineer, SSG
Job Description
The Amazon Devices team designs and engineers high-profile consumer electronics, including the best-selling Kindle family of products. We have also produced groundbreaking devices like Fire tablets, Fire TV, Amazon Dash, and Amazon Echo. What will you help us create? As a Sr Kernel Engineer you will help build the kernel stack and BSP for various SoCs with custom hardware accelerators to be deployed in a range of Amazon devices. You will develop software for industry standard and custom hardware IP to accelerate applications in machine learning, computer vision and robotics. In this role you will: - Develop and modify Board Support Package (BSP) components: This includes bootloaders (TF-A, OP-TEE, SCP, U-Boot), device drivers, kernel modules, and device tree support. - Collaborate with architecture teams to define and implement innovative silicon features. - Perform initial silicon and platform bring-up in both pre-silicon and post-silicon environments. - Debug and root-cause complex issues across hardware and software interfaces. - Partner with cross-functional teams to productize silicon solutions and ensure successful product delivery. - Optimize OS and kernel solutions to achieve excellent performance for supported features. - Contribute throughout product development stages including HVT, EVT, DVT, and PVT phases. - Engage with diverse cross-functional teams to ensure seamless feature integration and alignment across hardware, firmware, and software components.
Locations
- Bengaluru, Karnataka, India
Skills Required
- ARM v8/v9 architecture profilesintermediate
- thermal managementintermediate
- high-speed interfaces including USBintermediate
- low-speed interfaces such as Pinmuxintermediate
Required Qualifications
- 10+ years of non-internship professional software development experience (experience, 10 years)
- 10+ years of programming with at least one software programming language experience (experience, 10 years)
- 10+ years of leading design or architecture (design patterns, reliability and scaling) of new and existing systems experience (experience, 10 years)
- Experience as a mentor, tech lead or leading an engineering team (experience)
- Hands-on experience with ARM v8/v9 architecture profiles, including understanding of instruction sets, memory models, and security features. (experience)
- Demonstrated ability to debug complex system-level issues on embedded devices, including hardware-software integration challenges. (experience)
Preferred Qualifications
- 10+ years of full software development life cycle, including coding standards, code reviews, source control management, build processes, testing, and operations experience (experience, 10 years)
- Bachelor's degree in computer science or equivalent (degree in computer science or equivalent)
- Hands-on experience with embedded Linux Yocto distribution for custom BSP development. (experience)
- Strong knowledge of thermal management, power optimization, and performance tuning. (experience)
- Proven experience with high-speed interfaces including USB, eMMC, NAND, and PCIe. (experience)
- Proficiency with low-speed interfaces such as Pinmux, GPIO, SPI, I2C, UART, and PWM. (experience)
- Solid understanding of ARM security architecture, including ARM TrustZone technology. (experience)
Responsibilities
- Develop and modify Board Support Package (BSP) components: This includes bootloaders (TF-A, OP-TEE, SCP, U-Boot), device drivers, kernel modules, and device tree support.
- Collaborate with architecture teams to define and implement innovative silicon features.
- Perform initial silicon and platform bring-up in both pre-silicon and post-silicon environments.
- Debug and root-cause complex issues across hardware and software interfaces.
- Partner with cross-functional teams to productize silicon solutions and ensure successful product delivery.
- Optimize OS and kernel solutions to achieve excellent performance for supported features.
- Contribute throughout product development stages including HVT, EVT, DVT, and PVT phases.
- Engage with diverse cross-functional teams to ensure seamless feature integration and alignment across hardware, firmware, and software components.
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