Integration Engineer
Analog Devices
Integration Engineer
Job Description
About Analog DevicesAnalog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. The Process Integration Team is seeking an Integration Engineer to join a collaborative and highly technical group of 10-12 engineers with diverse backgrounds and expertise. This team partners closely with process module engineering organizations to identify, troubleshoot, and resolve manufacturing and quality challenges across the semiconductor fabrication process. Team members gain broad exposure to silicon-based semiconductor products, supporting all stages of production from starting silicon through wafer fabrication, assembly, and final packaged die. The role offers a unique opportunity to develop a comprehensive understanding of semiconductor manufacturing while driving yield, quality, and process improvements.Responsibilities include, but not limited to: Interpreting and responding to electrical signals from Si-based semiconductor devices and establishing connections to process conditionsLeading teams of process module engineers to resolve yield and parametric problemsOptimization of semiconductor manufacturing processes to improve productivity and/or qualityInterpretation of SEM, TEM, and EDX analysis to establish root cause of electrical signals in semiconductor devicesTransfer of Si semiconductor processes between manufacturing facilities and to larger wafer diameter in the same facilityTeamwork with Product and Defect engineering to identify yield limiters for yield improvementMinimum qualifications BS or MS in Electrical Engineering or associated engineering field with semiconductor device background0-3 years of experience working in a cleanroom environmentUnderstanding of CMOS and Bipolar Junction Transistor structures and device operationKnowledge of how process variables influence electrical characteristics of CMOS and BJT devicesAbility to work in a team environment with strong written and verbal communication skillsBasic understanding of operation of common semiconductor process operations: Photolithography, Plasma etch, Plasma Enhanced Chemical Vapor Deposition (PECVD), Epitaxial growth, Furnace oxidation and Low Pressure Chemical Vapor Deposition (LPCVD), Implant, Chemical Mechanical Polish (CMP), Wet chemical etch, Physical Vapor Deposition (PVD), Rapid Thermal Anneal (RTA)Preferred qualifications Knowledge of Statistical Process Control (SPC)For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.EEO is the Law: Notice of Applicant Rights Under the Law.Job Req Type: Experienced Required Travel: Yes, 10% of the time Shift Type: 1st Shift/DaysThe expected wage range for a new hire into this position is $75,200 to $103,400.Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.
Locations
- Beaverton, OR, US
Salary
75,200 - 103,400 USD / yearly
Skills Required
- Statistical Process Controlintermediate
Required Qualifications
- BS or MS in Electrical Engineering or associated engineering field with semiconductor device background (experience)
- 0-3 years of experience working in a cleanroom environment (experience, 3 years)
- Understanding of CMOS and Bipolar Junction Transistor structures and device operation (experience)
- Knowledge of how process variables influence electrical characteristics of CMOS and BJT devices (experience)
- Ability to work in a team environment with strong written and verbal communication skills (experience)
- Basic understanding of operation of common semiconductor process operations: Photolithography, Plasma etch, Plasma Enhanced Chemical Vapor Deposition (PECVD), Epitaxial growth, Furnace oxidation and Low Pressure Chemical Vapor Deposition (LPCVD), Implant, Chemical Mechanical Polish (CMP), Wet chemical etch, Physical Vapor Deposition (PVD), Rapid Thermal Anneal (RTA) (experience)
- BS or MS in Electrical Engineering or associated engineering field with semiconductor device background (experience)
- 0-3 years of experience working in a cleanroom environment (experience, 3 years)
- Understanding of CMOS and Bipolar Junction Transistor structures and device operation (experience)
- Knowledge of how process variables influence electrical characteristics of CMOS and BJT devices (experience)
- Ability to work in a team environment with strong written and verbal communication skills (experience)
- Basic understanding of operation of common semiconductor process operations: Photolithography, Plasma etch, Plasma Enhanced Chemical Vapor Deposition (PECVD), Epitaxial growth, Furnace oxidation and Low Pressure Chemical Vapor Deposition (LPCVD), Implant, Chemical Mechanical Polish (CMP), Wet chemical etch, Physical Vapor Deposition (PVD), Rapid Thermal Anneal (RTA) (experience)
Preferred Qualifications
- Knowledge of Statistical Process Control (SPC) (experience)
- Knowledge of Statistical Process Control (SPC) (experience)
- For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process. (experience)
- EEO is the Law: Notice of Applicant Rights Under the Law. (experience)
- Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors. (experience)
- This position qualifies for a discretionary performance-based bonus which is based on personal and company factors. (experience)
- This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits. (experience)
- Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors. (experience)
- This position qualifies for a discretionary performance-based bonus which is based on personal and company factors. (experience)
- This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits. (experience)
Responsibilities
- Interpreting and responding to electrical signals from Si-based semiconductor devices and establishing connections to process conditions
- Leading teams of process module engineers to resolve yield and parametric problems
- Optimization of semiconductor manufacturing processes to improve productivity and/or quality
- Interpretation of SEM, TEM, and EDX analysis to establish root cause of electrical signals in semiconductor devices
- Transfer of Si semiconductor processes between manufacturing facilities and to larger wafer diameter in the same facility
- Teamwork with Product and Defect engineering to identify yield limiters for yield improvement
- Interpreting and responding to electrical signals from Si-based semiconductor devices and establishing connections to process conditions
- Leading teams of process module engineers to resolve yield and parametric problems
- Optimization of semiconductor manufacturing processes to improve productivity and/or quality
- Interpretation of SEM, TEM, and EDX analysis to establish root cause of electrical signals in semiconductor devices
- Transfer of Si semiconductor processes between manufacturing facilities and to larger wafer diameter in the same facility
- Teamwork with Product and Defect engineering to identify yield limiters for yield improvement
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