Who We AreApplied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. What We OfferSalary:$124,000.00 - $171,000.00Location:Santa Clara,CAYou’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. Position SummaryApplied Materials is seeking a Global Product Support (GPS) Engineer to support installation, startup, qualification, and ongoing operation of the Kinex™ Hybrid Bonding platform being deployed for the CTO advanced packaging development programs.The successful candidate will serve as the primary equipment support engineer responsible for bringing the system from installation through process readiness while coordinating closely with Facilities, BESI, Applied Materials product engineering teams, and CTO process development teams.This role combines hands-on equipment support, system integration, startup execution, facilities coordination, and vendor engagement. The engineer will play a key role in establishing Kinex as a strategic advanced packaging platform supporting die-to-wafer hybrid bonding, optical interconnect, and next-generation heterogeneous integration development.Key ResponsibilitiesInstallation & StartupSupport Kinex installation activities from tool dock through release to engineering usersCoordinate Tier 0, Tier 1 and Tier 2 startup activitiesDrive closure of installation punch-list itemsSupport factory acceptance and site acceptance activities with vendorsDevelop recovery plans for installation and startup issuesFacilities IntegrationSupport Facility Data Sheet (FDS) development and updatesCoordinate with Facilities, EHS and infrastructure teamsDefine and validate tool utility requirementsSupport hookup and qualification activitiesEquipment SupportPerform troubleshooting of mechanical, electrical, automation, and process-related issuesDevelop preventative maintenance proceduresSupport uptime improvement effortsAnalyze equipment performance and reliability trendsDrive root cause investigations and corrective actionsVendor & Product Engineering EngagementAct as primary technical interface with BESI and Kinex product engineering teamsCoordinate technical reviews, service activities, upgrades, and modificationsManage escalation of hardware and software issuesSupport implementation of engineering changes and new capabilitiesAdvanced Packaging Development SupportSupport hybrid bonding process development activitiesWork closely with CTO process engineers and researchersEnable wafer-to-wafer and die-to-wafer bonding developmentSupport new module integration and experimental hardware evaluationsMinimum QualificationsBS in Mechanical Engineering, Electrical Engineering, Mechatronics, Systems Engineering or related engineering discipline3–7 years of engineering experience in semiconductor equipment – new college graduates applications will NOT be consideredExperience supporting semiconductor manufacturing or development equipmentStrong troubleshooting and root-cause analysis skillsExcellent verbal and written communication skillsAbility to work across facilities, vendors, process engineering, and operations teamsPreferred QualificationsHighly DesiredExperience with advanced packaging equipmentExperience with hybrid bonding, wafer bonding, die attach, packaging, or assembly systemsExperience with wet clean processes and systemsEquipment installation and startup experienceFacilities hookup and utility integration experienceVendor management and supplier coordination experienceHands-on experience troubleshooting complex semiconductor equipmentPreferredKnowledge of:Automated material handling systemsVacuum systemsPlasma processing systemsWet processing equipmentMetrology systemsExperience generating or reviewing:Site prep / installation documentationEquipment specificationsStartup plansQualification proceduresBonus QualificationsPrior experience with BESI equipmentHybrid bonding process knowledge300 mm equipment experienceProject management experienceCleanroom construction or tool installation experienceAdditional InformationTime Type:Full timeEmployee Type:Assignee / RegularTravel:Yes, 10% of the TimeRelocation Eligible:YesThe salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.