Job Description

Locations

• SGP, Singapore

Required Qualifications

• Bachelor’s degree in engineering. (degree in engineering)
• Minimum 4 years of experience working with semiconductor equipment in manufacturing or technical field service. (experience, 4 years)
• Bachelor’s degree in engineering. (degree in engineering)
• Minimum 4 years of experience working with semiconductor equipment in manufacturing or technical field service. (experience, 4 years)
• Able to work flexibly, including outside standard working hours, to collaborate with stakeholders across different time zones. (experience)
• Willingness to travel internationally to customer sites (approximately 10%). (experience)
• Able to work flexibly, including outside standard working hours, to collaborate with stakeholders across different time zones. (experience)
• Willingness to travel internationally to customer sites (approximately 10%). (experience)

Responsibilities

• Develop, implement, and maintain methods, operating sequences, and processes for the assemblies during start-up for semiconductor equipment.
• Lead the development and sustaining of field digitalized start-up procedures (iOMS) for Tier 0 & Tier 1 operations to improve efficiency and consistency.
• Allocate tasks to illustrators and oversee progress to ensure timely and high‑quality OMS & DOC deliverables.
• Manage BoM integrity across SHPK, MERG, ship-along, SRD, and other configuration sources, ensuring accuracy and alignment with product requirements.
• Drive automation initiatives to enhance work proficiency and reduce production and delivery cycle times.
• Reduce I&W (installation and warranty) costs by identifying and correcting BoM errors, improving procedures, and lowering field NCs and start-up cycle time through streamlined work processes.
• Review field NCs, analyze root causes, and work with corresponding teams develop action plans to prevent recurrence.
• Coordinate technical issues, RIT initiatives, and the introduction of new technologies and CIP projects (e.g., 3D OMS) across different business units and cross-functional teams.
• Work independently with limited documentation when needed, investigating and compiling data to recommend improvements using established reporting processes.
• Collaborate with cross-functional teams to drive complex projects related to quality issues, BoM optimization, and cost reduction.
• Interface with engineering teams to support the release of product improvements and new product instructions.
• Perform root cause analysis for issues arising during assembly and start-up phases.
• Support engineering change requests and partner with design and operations teams to implement changes efficiently for both new and existing products.
• Develop, implement, and maintain methods, operating sequences, and processes for the assemblies during start-up for semiconductor equipment.
• Lead the development and sustaining of field digitalized start-up procedures (iOMS) for Tier 0 & Tier 1 operations to improve efficiency and consistency.
• Allocate tasks to illustrators and oversee progress to ensure timely and high‑quality OMS & DOC deliverables.
• Manage BoM integrity across SHPK, MERG, ship-along, SRD, and other configuration sources, ensuring accuracy and alignment with product requirements.
• Drive automation initiatives to enhance work proficiency and reduce production and delivery cycle times.
• Reduce I&W (installation and warranty) costs by identifying and correcting BoM errors, improving procedures, and lowering field NCs and start-up cycle time through streamlined work processes.
• Review field NCs, analyze root causes, and work with corresponding teams develop action plans to prevent recurrence.
• Coordinate technical issues, RIT initiatives, and the introduction of new technologies and CIP projects (e.g., 3D OMS) across different business units and cross-functional teams.
• Work independently with limited documentation when needed, investigating and compiling data to recommend improvements using established reporting processes.
• Collaborate with cross-functional teams to drive complex projects related to quality issues, BoM optimization, and cost reduction.
• Interface with engineering teams to support the release of product improvements and new product instructions.
• Perform root cause analysis for issues arising during assembly and start-up phases.
• Support engineering change requests and partner with design and operations teams to implement changes efficiently for both new and existing products.

Benefits

• general: You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.
• general: At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

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