Major AccountabilitiesGuidance of high speed data interconnect design & optimization in terms of Signal Integrity (SI) and Electromagnetic Compatibility (EMC) in close cooperation with the international and interdisciplinary product development teamAnalysis and evaluation of SI/EMC related requirements (from customer RFQs, standards, workgroups etc.)Execution of fundamental investigations and feasibility studies for design conceptsIdentification of relevant design parameters, dimensions and tolerances having critical impact on performanceDetermination of potential optimizations considering costs, quality, manufacturability, mechanical and other constraintsSI and EMC simulations of high speed data connectors, cable assemblies and PCBs in high frequency range (up to 20 GHz and beyond)Participation at critical milestones of the product development process(e.g. concept reviews, design reviews, DFM meetings and DFMEAs)Alignment of simulation results with SI/EMC measurement results of physical samples and root cause analysis of failures and deviationsCreation of SI/EMC design guidelines for high speed data connectors, cable assemblies and PCBs and provide trainings for product and application engineersImprovement and automation of methods and procedures for the characterization, modeling, simulation, analysis and design of interconnections considering artificial intelligence based approachesParticipation in work groups and standardization committees such as Open Alliance, MIPI or ASAQualifications:Essential SkillsMaster degree in electrical or telecommunications engineering or bachelor degree with relevant experience in cable/device connector developmentAt least 3 years of professional experience in high-speed data communication(e.g. in automotive, telecommunication, PCB design)Proficient handling of electromagnetic field simulation tools (preferably ANSYS HFSS, optionally CST Microwave Studio or others)Substantial theoretical background on electromagnetics and numerical methodszuKnowledge of SI/EMC standards and specifications (e.g. Open Alliance)Strong analytical skillsWillingness to travel (e.g. to customers, suppliers, workgroups, conferences)Business fluent English and good German language skillsGood intercultural skills and team playerOptional SkillsExperience with RF test equipment for SI and EMC measurements (vector network analyzer, TDR, oscilloscope, tube/triaxial cell etc.)Knowledge of PCB design and simulation tools (e.g. Mentor Xpedition, HyperLynx, Spice)Knowledge of requirements management tools (e.g. Polarion, Doors)Experience in programming/scripting languages (e.g. VBA, Python)Privacy Notice - Active Candidates: https://www.aptiv.com/privacy-notice-active-candidatesAptiv is an equal employment opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, national origin, sex, gender identity, sexual orientation, disability status, protected veteran status or any other characteristic protected by law.