Job Description

Locations

• USA-Colorado-Fort Collins-4380 Ziegler Road

Salary

Skills Required

• photolithographyintermediate
• TEL_ACT8intermediate
• Wafer-Level Packagingintermediate
• ASML equipmentintermediate
• wide variety of photolithography toolsintermediate
• engineering fundamentals for all areas of fab processingintermediate
• Fault Detection & Classificationintermediate

Required Qualifications

• BS (MS or higher preferred) in EE, ME, ChE, Materials Science, Physics or Chemistry and 8+ years of related experience. Or MS in EE, ME, ChE, Material Sciences, Physics or Chemistry and 6+ years related experience. Or PhD in EE, ME, ChE, Material Sciences, Physics or Chemistry and 3+ years of related experience (experience, 8 years)
• Expertise in photolithography, this position designed for highly autonomous experts. This is not an entry level position. (experience)
• Proficiency in a wide variety of photolithography tools. Experience with TEL_ACT8 and PAS5500 equipment is highly desirable. Experience with Wafer-Level Packaging (WLP), through silicon vias (TSVs), or thick resist processing (e.g. polyimides, chem amp resists, etc.) is desirableExposure Focus: Deep experience with ASML equipment (PAS5500), advanced process control, overlay optimization, and i-line steppers.Track Focus: Deep track background (TEL_ACT8) focused on R&D, new layer development, and new resist materials selection. (experience)
• Expertise in engineering fundamentals for all areas of fab processing (experience)
• Understanding of general processing techniques and concepts for silicon-based MEMS devices applications including interdependencies with other unit processes. (experience)
• Strength in Statistical Process Control for a high-volume manufacturing facility. Mature data analysis skills using tools such as JMP, Minitab, Spotfire and Excel/Access is required. (experience)
• Candidates with practical experience in Fault Detection & Classification (FDC) systems, Copy Exactly (CE!) methodology, High Precision Maintenance (HPM), TPS, and Lean will be considered preferentially. (experience)
• Proven ability to work in a dynamic environment and deliver results. (experience)
• Strong troubleshooting skills. (experience)
• Excellent ownership, initiative and communication skills. (experience)
• Track record of self-motivated and collaborative learning. (experience)
• Ability to prioritize and multitask. (experience)
• Strong cross functional teamwork skills and demonstrated ability to deliver improvements within a team environment. (experience)
• Attention to detail is essential. (experience)
• Legal authorization to work in the U.S. is required. (experience)
• BS (MS or higher preferred) in EE, ME, ChE, Materials Science, Physics or Chemistry and 8+ years of related experience. Or MS in EE, ME, ChE, Material Sciences, Physics or Chemistry and 6+ years related experience. Or PhD in EE, ME, ChE, Material Sciences, Physics or Chemistry and 3+ years of related experience (experience, 8 years)
• Expertise in photolithography, this position designed for highly autonomous experts. This is not an entry level position. (experience)
• Proficiency in a wide variety of photolithography tools. Experience with TEL_ACT8 and PAS5500 equipment is highly desirable. Experience with Wafer-Level Packaging (WLP), through silicon vias (TSVs), or thick resist processing (e.g. polyimides, chem amp resists, etc.) is desirable (experience)
• Exposure Focus: Deep experience with ASML equipment (PAS5500), advanced process control, overlay optimization, and i-line steppers. (experience)
• Track Focus: Deep track background (TEL_ACT8) focused on R&D, new layer development, and new resist materials selection. (experience)
• Expertise in engineering fundamentals for all areas of fab processing (experience)
• Understanding of general processing techniques and concepts for silicon-based MEMS devices applications including interdependencies with other unit processes. (experience)
• Strength in Statistical Process Control for a high-volume manufacturing facility. Mature data analysis skills using tools such as JMP, Minitab, Spotfire and Excel/Access is required. (experience)
• Candidates with practical experience in Fault Detection & Classification (FDC) systems, Copy Exactly (CE!) methodology, High Precision Maintenance (HPM), TPS, and Lean will be considered preferentially. (experience)
• Proven ability to work in a dynamic environment and deliver results. (experience)
• Strong troubleshooting skills. (experience)
• Excellent ownership, initiative and communication skills. (experience)
• Track record of self-motivated and collaborative learning. (experience)
• Ability to prioritize and multitask. (experience)
• Strong cross functional teamwork skills and demonstrated ability to deliver improvements within a team environment. (experience)
• Attention to detail is essential. (experience)

Responsibilities

• Development and characterization of robust solutions to R&D needs in collaboration with development engineering groups.
• Combination of layer and process tool ownership. Responsible for managing CD and overlay SPC charts, along with layer defect monitoring.
• Ownership of photo processes on ASML i-line steppers and high-topography exposure systems for MEMS Silicon based technologies. This will include sustaining high volume manufacturing lines, as well as some new processes, materials, and applications development.
• Yield, quality and cost improvements to existing unit processes, to deliver highly robust and consistent results in collaboration with equipment maintenance and operational organizations.
• Collaborate with Equipment Engineering and R&D to conceptualize and progress opportunities that enable continued technological leadership, working across roles & teams, both internal and external, to deliver benefit to the business.
• Experimental design and data analysis to support the line sustaining work, process development and process improvements. Solid identification and resolution of yield and defect issues with clear communication of results across the organization.
• Organizes and manages long-term improvement projects to meet organizational goals. Work with peers and the equipment engineering/maintenance teams to establish project objectives, schedules and resource profiles for projects.
• Implement robust monitoring methodologies enabling early detection of excursions in equipment performance before product is impacted (e.g. SPC, FDC, baselining & matching).
• Development and characterization of robust solutions to R&D needs in collaboration with development engineering groups.
• Combination of layer and process tool ownership. Responsible for managing CD and overlay SPC charts, along with layer defect monitoring.
• Ownership of photo processes on ASML i-line steppers and high-topography exposure systems for MEMS Silicon based technologies. This will include sustaining high volume manufacturing lines, as well as some new processes, materials, and applications development.
• Yield, quality and cost improvements to existing unit processes, to deliver highly robust and consistent results in collaboration with equipment maintenance and operational organizations.
• Collaborate with Equipment Engineering and R&D to conceptualize and progress opportunities that enable continued technological leadership, working across roles & teams, both internal and external, to deliver benefit to the business.
• Experimental design and data analysis to support the line sustaining work, process development and process improvements. Solid identification and resolution of yield and defect issues with clear communication of results across the organization.
• Organizes and manages long-term improvement projects to meet organizational goals. Work with peers and the equipment engineering/maintenance teams to establish project objectives, schedules and resource profiles for projects.
• Implement robust monitoring methodologies enabling early detection of excursions in equipment performance before product is impacted (e.g. SPC, FDC, baselining & matching).

Benefits

• general: The annual base salary range for this position is $109,700 - $175,500
• general: This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
• general: As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements
• general: Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
• general: If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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