Please Note:1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)2. If you already have a Candidate Account, please Sign-In before you apply.Job Description:Physical Design Implementation: An ideal candidate having strong background in either the Physical Design which includes floor planning, placement, design closure, STA, and DRC & LVS skills. Overall, candidates are expected to develop the most of above skills. Candidates who have the desire to seek the in-depth and broad technical challenge should apply. It would be better if the candidate have the experience running full chip signoff tasks including PI, SI, PV and STA. Requirements/Qualifications- Candidates should have good understanding about ASIC design flow and solid VLSI background. - Candidates should be able to handle block implementation/top level task independently. - Tapeout experience in 7nm and blow process design.- Candidate s should have strong communications and problem solving skills. - Candidates with experience in any one of following knowledge are a plus - DFT insertion - Power/IVD analysis - DRC/LVS- STA- Candidate is good at Perl/TclEducation/Certifications Preferred Degree: 7+ years MS Preferred Major: Microelectronics or related discipline Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.