Job Description

Locations

• USA-CA San Jose Innovation Drive
• USA-Colorado-Fort Collins-4380 Ziegler Road

Skills Required

• oneintermediate

Required Qualifications

• BS +12yrs, MS +10 yrs or PhD +7yrs Electrical Engineering or Physics and years experience in one or more of:Signal integrity for high-speed digital applicationsElectromagnetic transmission line theoryMicrowave theoryNumerical Field solver theoryPower integrityIC package designPhotonics (experience)
• BS +12yrs, MS +10 yrs or PhD +7yrs Electrical Engineering or Physics and years experience in one or more of: (experience)
• Signal integrity for high-speed digital applications (experience)
• Electromagnetic transmission line theory (experience)
• Microwave theory (experience)
• Numerical Field solver theory (experience)
• IC package design (experience)

Responsibilities

• Support high data rate SerDes applications - up to 400G systems
• System level Signal and Power Integrity design trade-offs and debug
• Collaborate with package, PCB, and silicon designers to complete measurement-simulation correlation projects
• Develop models with electromagnetic field solvers: primarily with Ansys HFSS and electronic suite.
• Ability to understand laminate design and fabrication techniques and limitations for both package and PCB designs.
• Evaluate system, PCB and package material and connector solutions for future designs.
• Simulate schematic models and environments within Keysight ADS.
• Ensure and know trade-offs for the accuracy of models (3D/2.5D/2D) used for design simulations.
• Perform and develop VNA/TDR (50GHz+) measurement techniques and correlate with models and simulations.
• Provide feedback and learnings from measurement-simulation correlation investigations to improve best practices for modeling and simulations.
• Capture high fidelity lab measurements to be used for correlation and debug purposesExperience with sampling and real-time oscilloscopes, spectrum analyzers, and optical oscilloscopes.
• Support high data rate SerDes applications - up to 400G systems
• System level Signal and Power Integrity design trade-offs and debug
• Collaborate with package, PCB, and silicon designers to complete measurement-simulation correlation projects
• Develop models with electromagnetic field solvers: primarily with Ansys HFSS and electronic suite.
• Ability to understand laminate design and fabrication techniques and limitations for both package and PCB designs.
• Evaluate system, PCB and package material and connector solutions for future designs.
• Simulate schematic models and environments within Keysight ADS.
• Ensure and know trade-offs for the accuracy of models (3D/2.5D/2D) used for design simulations.
• Perform and develop VNA/TDR (50GHz+) measurement techniques and correlate with models and simulations.
• Provide feedback and learnings from measurement-simulation correlation investigations to improve best practices for modeling and simulations.
• Capture high fidelity lab measurements to be used for correlation and debug purposes
• Experience with sampling and real-time oscilloscopes, spectrum analyzers, and optical oscilloscopes.
• Understand and apply:
• High speed data communications
• Transmission-line and electromagnetic-field theory
• Numerical analysis
• VNA/TDR measurements
• Bit-by-bit and Statistical simulators for serial data (SerDes) links
• Insertion loss, return loss, crosstalk, BER, jitter, and statistical eye diagrams
• Work in either time domain or frequency domain
• Phase noise analysis as it applies to PLL’s, reference clocks, SerDes TX-RX links
• Jitter sensitivity measurement and analysis for SerDes IP
• Organize and manage multiple projects
• Develop, clearly and effectively document, and track project plans
• Effectively communicate complex concepts in conversation, presentations and written documents
• Determine and document applicable requirements for ASIC package and PCB designs, drawing from industry standards, customer requirements, and/or APD Broadcom’s internal performance goals
• Collaborate with Package and PCB Engineers to fulfill System SI requirements, while balancing objectives (reliability, cost, complexity, etc.)
• Pre-layout and post-layout modeling and simulation to support package and PCB engineering for signal integrity
• Document and deliver SI models with supporting documentation to customer and internal engineers
• Support customer analysis and debug efforts related to our deliverables
• Understanding of optical/electrical engine concepts and theory of operation, CWDM, OMA, etc..
• Familiarity with optical channel impairments such as chromatic dispersion (CD) and four-wave mixing (FWM).
• Power Integrity Concepts: PDN impedance analysis and design, ultra-low impedance measurements, understanding of SMT capacitor performance metrics, use of CPA and/or SI-Wave for PDN simulations.
• High speed data communications
• Transmission-line and electromagnetic-field theory
• Numerical analysis
• VNA/TDR measurements
• Bit-by-bit and Statistical simulators for serial data (SerDes) links
• Insertion loss, return loss, crosstalk, BER, jitter, and statistical eye diagrams
• Work in either time domain or frequency domain
• Phase noise analysis as it applies to PLL’s, reference clocks, SerDes TX-RX links
• Jitter sensitivity measurement and analysis for SerDes IP
• Organize and manage multiple projects
• Develop, clearly and effectively document, and track project plans
• Effectively communicate complex concepts in conversation, presentations and written documents
• Determine and document applicable requirements for ASIC package and PCB designs, drawing from industry standards, customer requirements, and/or APD Broadcom’s internal performance goals
• Collaborate with Package and PCB Engineers to fulfill System SI requirements, while balancing objectives (reliability, cost, complexity, etc.)
• Pre-layout and post-layout modeling and simulation to support package and PCB engineering for signal integrity
• Document and deliver SI models with supporting documentation to customer and internal engineers
• Support customer analysis and debug efforts related to our deliverables
• Understanding of optical/electrical engine concepts and theory of operation, CWDM, OMA, etc..
• Familiarity with optical channel impairments such as chromatic dispersion (CD) and four-wave mixing (FWM).
• Power Integrity Concepts: PDN impedance analysis and design, ultra-low impedance measurements, understanding of SMT capacitor performance metrics, use of CPA and/or SI-Wave for PDN simulations.

Benefits

• general: As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
• general: Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
• general: Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
• general: If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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