Wafer Fab Process Engineer
Broadcom
Wafer Fab Process Engineer
Job Description
Please Note:1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)2. If you already have a Candidate Account, please Sign-In before you apply.Job Description:Job SummaryLead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.Key ResponsibilitiesOwn and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.Drive new process integration (NPI) and process transfer to high-volume manufacturing.Perform root cause analysis and implement robust corrective/preventive actions.Define process control plans, SPC strategies, and OCAP execution.Collaborate cross-functionally with equipment, integration, quality, and R&D teams.Mentor junior engineers and technicians.Interface with suppliers on process and material improvements.QualificationsBachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation).Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.Demonstrated leadership in cross-functional technical projects.Strong analytical, problem-solving, and communication skillsPreferredPhD in Engineering (Electrical, Chemical, Materials, or related).Six Sigma certification (Green/Black Belt).Experience supporting 4" to 6" wafer scaling or equivalent manufacturing transition.Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Locations
- Singapore-Depot Road
Skills Required
- thin filmintermediate
- SPCintermediate
Required Qualifications
- Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related). (degree in master)
- At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation). (experience, 5 years)
- Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools. (experience)
- Demonstrated leadership in cross-functional technical projects. (experience)
- Strong analytical, problem-solving, and communication skills (experience)
- Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related). (degree in master)
- At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation). (experience, 5 years)
- Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools. (experience)
- Demonstrated leadership in cross-functional technical projects. (experience)
- Strong analytical, problem-solving, and communication skills (experience)
Preferred Qualifications
- PhD in Engineering (Electrical, Chemical, Materials, or related). (degree in engineering)
- Six Sigma certification (Green/Black Belt). (certification)
- Experience supporting 4" to 6" wafer scaling or equivalent manufacturing transition. (experience)
- PhD in Engineering (Electrical, Chemical, Materials, or related). (degree in engineering)
- Six Sigma certification (Green/Black Belt). (certification)
- Experience supporting 4" to 6" wafer scaling or equivalent manufacturing transition. (experience)
- If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence. (experience)
Responsibilities
- Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).
- Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
- Drive new process integration (NPI) and process transfer to high-volume manufacturing.
- Perform root cause analysis and implement robust corrective/preventive actions.
- Define process control plans, SPC strategies, and OCAP execution.
- Collaborate cross-functionally with equipment, integration, quality, and R&D teams.
- Mentor junior engineers and technicians.
- Interface with suppliers on process and material improvements.
- Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).
- Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
- Drive new process integration (NPI) and process transfer to high-volume manufacturing.
- Perform root cause analysis and implement robust corrective/preventive actions.
- Define process control plans, SPC strategies, and OCAP execution.
- Collaborate cross-functionally with equipment, integration, quality, and R&D teams.
- Mentor junior engineers and technicians.
- Interface with suppliers on process and material improvements.
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