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半導体エンジニア(2026・2027年卒/既卒歓迎)|Semiconductor Engineer – Class of 2026/2027 & Recent Graduates

Micron Technology

半導体エンジニア(2026・2027年卒/既卒歓迎)|Semiconductor Engineer – Class of 2026/2027 & Recent Graduates

full-timePosted: Aug 2, 2026Updated: Sep 1, 2026Japan, Hiroshima - Fab 15

Job Description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.◆生産技術開発職(広島拠点)◆量産化に向けた技術的な課題解決、生産性向上、コスト削減や品質管理、生産装置の改造・維持・管理など幅広い業務を担当します。配属職種:・プロセスエンジニア化学反応や動作条件の最適化を行い、新しい装置や条件を生産に適用する。各要素技術のエキスパート。・製品技術エンジニア製品プロセスの構築・改善を担当。不良・スペック外発生の原因分析、プロセス改善を行う。・装置エンジニア生産装置の構造・動作理解を深め、装置の改良や生産性向上に寄与。・生産工学エンジニアデータ解析を通じて生産性を高めるための改善提案や生産計画の立案を担当。・品質技術エンジニア原材料管理、クリーンルーム環境、生産プロセス、検査システム、出荷テストなど品質保証に関する業務。◆先端技術開発職(広島拠点)◆次世代CMOSトランジスタやキャパシタの新技術開発に携わり、高性能化・低コスト化・低消費電力化・高信頼性化を目指します。主な業務内容・半導体プロセス技術(乾式エッチング、薄膜成膜等)の理解と実践・プロセスパラメータとデバイス構造・性能の関係分析・デバイス構造・特性の最適化導案・実施◆評価解析エンジニア(神奈川拠点/広島拠点)DRAM試作ウェハ/チップを専用テスタで評価し、機能・速度・消費電力・電圧などを測定し、開発チームへのフィードバックを通じて市場ニーズに沿った製品改良に貢献します。主な業務内容・各種性能指標(スピード、電力、動作電圧など)の測定・解析・プロセス・設計チームへの評価結果の報告、製品改善提案・DRAMの新機能・高性能・低電力化に関する製品評価応募資格:・理系学部卒以上(2027年3月までに卒業の方。既卒可)・分析力、問題解決力・英語力不問・半導体知識不問◆ Manufacturing Engineer (Hiroshima) ◆Responsible for a wide range of tasks, including solving technical challenges for mass production, improving productivity, reducing costs, managing quality, and modifying, maintaining, and managing production equipment.Process Engineer: Optimize chemical reactions and operating conditions; apply new equipment and conditions to production. Expert in individual process technologies.Product Technology Engineer: Build and improve product processes; analyze causes of defects and out-of-spec issues; implement process improvements.Equipment Engineer: Deepen understanding of production equipment structure and operation; contribute to equipment improvements and productivity enhancement.Production Engineering: Use data analysis to propose productivity improvements and plan production strategies.Quality Technology Engineer: Handle quality assurance tasks such as raw material management, cleanroom environment, production processes, inspection systems, and shipping tests.◆ Technology Development Engineer (Hiroshima) ◆Engage in the development of new technologies for next-generation CMOS transistors and capacitors, aiming for higher performance, lower cost, reduced power consumption, and improved reliability.Key Responsibilities:Understand and apply semiconductor process technologies (e.g., dry etching, thin-film deposition).Analyze relationships between process parameters and device structure/performance.Propose and implement optimization of device structures and characteristics.◆Circuit Design, Evaluation & Analysis Engineer (Kanagawa / Hiroshima) ◆Evaluate prototype DRAM wafers and chips using specialized testers to measure functionality, speed, power consumption, and operating voltage, contributing to product improvements aligned with market needs.Key Responsibilities:Measure and analyze performance indicators such as speed, power, and operating voltage.Report evaluation results to process and design teams; propose product improvements.Conduct evaluations for new DRAM features, high performance, and low power consumption.Qualifications:Bachelor’s degree or higher in a science or engineering field. (Graduates and students expected to graduate by March 2027 are eligible)Strong analytical and problem-solving skills.No English proficiency required.No prior semiconductor knowledge required.About Micron Technology, Inc.We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.To learn more, please visit micron.com/careersAll qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_japan@micron.comMicron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Locations

  • Japan, Hiroshima - Fab 15

Required Qualifications

  • Bachelor’s degree or higher in a science or engineering field. (Graduates and students expected to graduate by March 2027 are eligible) (degree in higher in a science or engineering field)
  • Strong analytical and problem-solving skills. (experience)
  • No English proficiency required. (experience)
  • No prior semiconductor knowledge required. (experience)

Responsibilities

  • Understand and apply semiconductor process technologies (e.g., dry etching, thin-film deposition).
  • Analyze relationships between process parameters and device structure/performance.
  • Propose and implement optimization of device structures and characteristics.
  • Measure and analyze performance indicators such as speed, power, and operating voltage.
  • Report evaluation results to process and design teams; propose product improvements.
  • Conduct evaluations for new DRAM features, high performance, and low power consumption.

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