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Electrical Failure Analysis Engineer – NAND Technology

Micron Technology

Electrical Failure Analysis Engineer – NAND Technology

full-timePosted: Aug 2, 2026Updated: Sep 1, 2026Singapore, Fab 10N/X

Job Description

Our vision is to transform how the world uses information to enrich life for all.Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.Join our NAND Technology Integration (NTI) team as an experienced Electrical Failure Analysis Engineer, where you will be the go-to expert for diagnosing yield-limiting failures in next-generation NAND products. You will combine deep semiconductor expertise with bench testing, probe data analysis, and physical failure analysis to pinpoint failure mechanisms, accelerate yield learning, and deliver actionable insights that shape the technology development lifecycle.Key ResponsibilitiesLead electrical failure analysis — characterization, fault isolation, failure verification, and physical de-processing of semiconductor devices.Drive root cause analysis of yield-limiting failures by correlating electrical, inline, parametric, probe, and fab data.Pioneer new FA methodologies and de-processing techniques to improve detection accuracy and turnaround time.Apply data analytics to large-scale semiconductor datasets to surface failure signatures, trends, and anomalies.Deliver clear FA reports and visualizations that communicate findings to technical and executive audiences.Partner with Process Integration, Yield Enhancement, Metrology, RDA, and Data Science teams to drive yield improvement.Support technology transfer of layout and architecture fundamentals from R&D to manufacturing.Present results in global forums with Product Development, Process Integration, and Manufacturing teams.Communicate with strong explainability — backed by feature importance, sensitivity analysis, and failure trend narratives.Adhere to all health, safety, and environmental standards.Qualifications and ExperienceM.S., or Ph.D. in Electrical Engineering, Microelectronics, Materials Science, Chemical Engineering, Physics, or a related field.Proven semiconductor industry experience in Failure Analysis, Process Integration, Yield Enhancement, or Unit Process.In-depth knowledge of nonvolatile memory technologies (NAND/NOR).Strong grasp of semiconductor process flow and process–device interactions.Hands-on or theoretical expertise with SEM, FIB, TEM, and elemental analysis (EDS, EELS).Excellent analytical, communication, and presentation skills — able to translate complex findings into clear narratives.Self-motivated, with a track record of thriving in a fast-paced, dynamic environment. About Micron Technology, Inc.We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.To learn more, please visit micron.com/careersAll qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.comMicron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Locations

  • Singapore, Fab 10N/X

Skills Required

  • Failure Analysisintermediate
  • nonvolatile memory technologiesintermediate
  • SEMintermediate

Required Qualifications

  • M.S., or Ph.D. in Electrical Engineering, Microelectronics, Materials Science, Chemical Engineering, Physics, or a related field. (experience)
  • Proven semiconductor industry experience in Failure Analysis, Process Integration, Yield Enhancement, or Unit Process. (experience)
  • In-depth knowledge of nonvolatile memory technologies (NAND/NOR). (experience)
  • Strong grasp of semiconductor process flow and process–device interactions. (experience)
  • Hands-on or theoretical expertise with SEM, FIB, TEM, and elemental analysis (EDS, EELS). (experience)
  • Excellent analytical, communication, and presentation skills — able to translate complex findings into clear narratives. (experience)
  • Self-motivated, with a track record of thriving in a fast-paced, dynamic environment. (experience)

Responsibilities

  • Lead electrical failure analysis — characterization, fault isolation, failure verification, and physical de-processing of semiconductor devices.
  • Drive root cause analysis of yield-limiting failures by correlating electrical, inline, parametric, probe, and fab data.
  • Pioneer new FA methodologies and de-processing techniques to improve detection accuracy and turnaround time.
  • Apply data analytics to large-scale semiconductor datasets to surface failure signatures, trends, and anomalies.
  • Deliver clear FA reports and visualizations that communicate findings to technical and executive audiences.
  • Partner with Process Integration, Yield Enhancement, Metrology, RDA, and Data Science teams to drive yield improvement.
  • Support technology transfer of layout and architecture fundamentals from R&D to manufacturing.
  • Present results in global forums with Product Development, Process Integration, and Manufacturing teams.
  • Communicate with strong explainability — backed by feature importance, sensitivity analysis, and failure trend narratives.
  • Adhere to all health, safety, and environmental standards.

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