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ENGINEER, APTD Wafer Thinning / CMP process

Micron Technology

ENGINEER, APTD Wafer Thinning / CMP process

full-timePosted: Aug 2, 2026Updated: Sep 1, 2026Taiwan, Taichung - Fab 16

Job Description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Specific Responsibilities:1. Drive improvement in wafer thinning / CMP process performance.2. Coordinate experiments for technology development and yield improvement3. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues6. Generate internal and external documentation for presentations and technical reports Technology Development1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs.2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization.3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site.4. Provide recommendations for test structure and test vehicle design for material property evaluation.5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps.Qualifications:1. More than 2 years experience in semiconductor related industry2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields3. Must have one of experiences of Si grinding, Edge Trim, Si CMP, Cu CMP, Oxide CMP technologies 4. Understanding on the key CMP metrics - Planarity, RR, selectivity, dishing, erosion, surface roughness, and defectivity5. Innovative and integration mindset with independent thinking 6. Good team player with a high motivation 7. Fluent communication in both English and Chinese About Micron Technology, Inc.We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.To learn more, please visit micron.com/careersAll qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com. Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Locations

  • Taiwan, Taichung - Fab 16

Skills Required

  • semiconductor related industryintermediate

Required Qualifications

  • 1. More than 2 years experience in semiconductor related industry (experience, 2 years)
  • 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields (degree in in chemistry)
  • 3. Must have one of experiences of Si grinding, Edge Trim, Si CMP, Cu CMP, Oxide CMP technologies (experience)
  • 4. Understanding on the key CMP metrics - Planarity, RR, selectivity, dishing, erosion, surface roughness, and defectivity (experience)
  • 5. Innovative and integration mindset with independent thinking (experience)
  • 6. Good team player with a high motivation (experience)
  • 7. Fluent communication in both English and Chinese (experience)

Responsibilities

  • 1. Drive improvement in wafer thinning / CMP process performance.
  • 2. Coordinate experiments for technology development and yield improvement
  • 3. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development
  • 4. Support project on-site execution and make decisions as technical consultant
  • 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues
  • 6. Generate internal and external documentation for presentations and technical reports
  • Technology Development
  • 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs.
  • 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization.
  • 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site.
  • 4. Provide recommendations for test structure and test vehicle design for material property evaluation.
  • 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps.

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