Our vision is to transform how the world uses information to enrich life for all.Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.As a Bonding Process & Equipment Engineer at Micron Technology, you will be part of Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer leve bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding).You will drive yield improvement, cost reduction, process capability enhancement, and risk management, while resolving complex manufacturing challenges. This role requires collaboration across process integration, equipment engineering, suppliers, and global manufacturing sites.Key ResponsibilitiesProcess Development & OptimizationDevelop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration)Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targetsDrive process capability improvement (Cpk) and defect reductionYield & Reliability ImprovementLead yield enhancement initiatives by analyzing process, tool, and material interactionsPerform systematic root cause analysis using methodologies such as DOE, FMEA, 8D, SPC, and fault isolation techniquesEvaluate defect modes (voids, misalignment, delamination, corrosion) and implement corrective actionsEquipment & Materials EngineeringCollaborate with equipment engineering to qualify and optimize bonding grinding and trimming tools (e.g., EVG, TEL, Disco platforms)Define equipment specifications, roadmap, process control strategies, and matching/fingerprinting requirementsEvaluate and introduce new materials/spares/parts for performance improvementTechnology Transfer & Process IntegrationSupport technology transfer and ramp-up across global sitesAlign process baseline (POR) and ensure consistency through documentation and control plansWork closely with integration, CMP, WET, and Films teams to ensure cross-module compatibilityManufacturing Support & Problem SolvingDiagnose and resolve manufacturing line issues impacting bonding yield and performanceAnalyze process excursions and implement containment and recovery actionsDrive continuous improvement for cycle time, tool availability, and cost efficiencyQualification & ControlLead new process and baseline qualificationsDevelop control plans, SPC strategies, and inline monitoring systemsEstablish risk mitigation frameworks and ensure compliance with manufacturing standardsSupplier & Cross-Functional CollaborationPartner with suppliers for technology development, process improvement, and cost optimizationAudit material and equipment suppliers to ensure quality and reliability targets are metCollaborate with global teams and partners to drive alignment and executionAI Responsibilities: • Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.Requirements:Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or related field7 years+ Relevant proven experience in semiconductor manufacturing or advanced packagingStrong knowledge of semiconductor bonding processes (wafer to wafer hybrid bonding, fusion bonding preferred)Understanding of Cu plating, CMP interaction, surface preparation, and defect mechanismsExperience with advanced packaging technologies (HBM, TSV, wafer-to-wafer bonding) is highly preferredProficiency in data analysis, SPC, and statistical modelingStrong problem-solving skills using structured methodologies (8D, FMEA, DOE)Ability to manage complex projects involving multiple functions in a high-volume manufacturing environmentExcellent communication and collaboration skills across global teams12-inch wafer-to-wafer bonding (from TEL or EVG tool is preferred) and/or 12-inch wafer backside grinding (from Disco tool is preferred)About Micron Technology, Inc.We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.To learn more, please visit micron.com/careersAll qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.comMicron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.