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Advanced PCB Technology Engineer

Nokia

Advanced PCB Technology Engineer

full-timePosted: Apr 21, 2026Updated: Sep 3, 2026Canada

Job Description

Join our team as we continue to expand our product portfolio in the Data Center and Carrier Service Provider. The IP Routing Hardware organization is very flat - there are few levels of management between the Individual Contributor and the VP of Hardware. We are also very lean - each Hardware Engineer spends more time doing engineering work and less time on overhead. As a result, your work has high visibility, and your decisions directly impact product design. As an Advanced PCB Technology Engineer, you will:Explore the use of new IC, PCB, component technology for future designsEngage suppliers in technology roadmap discussions to remain aware of latest technologiesWork with EMS (Electronic Manufacturing Supplier) to ensure technology readiness at the PCB assembly levelAssess the reliability and applicability of new technologies for Telecom applicationsOversee complex failure analysis investigations to determine root causePerform hands on failure analysis and laboratory work when necessaryWork directly with Digital Hardware Designers to implement new or existing technology Minimum B.Sc or B.Eng in Mechanical, Electrical, or Metallurgical Engineering10+ years of experience with SMT process and PCB fabricationUnderstanding of electronics products and assembliesProblem-solving experience including running Design of Experiment (DOE)It would be nice if you also had:Experience with semiconductor technology and IC packagingHands-on experience conducting failure analysis in a labStrong ability to learn and adopt new technologies to creatively solve leading-edge problems

Locations

  • Canada
  • March Rd Tower 3

Skills Required

  • SMT processintermediate
  • semiconductor technologyintermediate

Required Qualifications

  • Minimum B.Sc or B.Eng in Mechanical, Electrical, or Metallurgical Engineering (experience)
  • 10+ years of experience with SMT process and PCB fabrication (experience, 10 years)
  • Understanding of electronics products and assemblies (experience)
  • Problem-solving experience including running Design of Experiment (DOE) (experience)
  • Experience with semiconductor technology and IC packaging (experience)
  • Hands-on experience conducting failure analysis in a lab (experience)
  • Strong ability to learn and adopt new technologies to creatively solve leading-edge problems (experience)

Responsibilities

  • Explore the use of new IC, PCB, component technology for future designs
  • Engage suppliers in technology roadmap discussions to remain aware of latest technologies
  • Work with EMS (Electronic Manufacturing Supplier) to ensure technology readiness at the PCB assembly level
  • Assess the reliability and applicability of new technologies for Telecom applications
  • Oversee complex failure analysis investigations to determine root cause
  • Perform hands on failure analysis and laboratory work when necessary
  • Work directly with Digital Hardware Designers to implement new or existing technology

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