Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems. This role focuses on end-to-end package design ownership, including architecture definition, SI/PI analysis, electromagnetic modeling, and measurement correlation, while working closely with silicon, PCB, and system integration teams. The successful candidate will also contribute to package design enablement through ADKs and reusable libraries, in close collaboration with leading EDA vendors. Package and system design leadership is the primary emphasis of this role. This position is suitable for senior-level engineers who are comfortable taking ownership of complex package designs while influencing broader design flows and infrastructure. Lead the design and development of high-speed IC packages, including SiP, FC-BGA, and advanced heterogeneous integration solutions Define package architectures, stack-ups, routing strategies, and interconnect to meet SI/PI and RF requirements Perform 3D EM simulation and SI/PI analysis of package transitions, passive components, and die-to-package interfaces Co-optimize die, package, and PCB designs in collaboration with silicon, board, and system integration teams Correlate simulation results with laboratory measurements (e.g., VNA, TDR/TDT, high-speed oscilloscope) Contribute to the definition and evolution of package ADKs, reusable libraries, technology files, and verification flows, working in partnership with EDA vendors Provide technical input and design validation for vendor-supported automation and enablement efforts Support continuous improvement of package design methodologies and best practices across projects Required Qualifications MS or PhD in Electrical Engineering, Applied Physics, or equivalent relevant industry experience 5+ years of hands-on experience in IC package design for high-speed, RF, or mixed-signal applications Strong fundamentals in electromagnetics, signal integrity, and power integrity Experience with 3D EM and package design tools (e.g., HFSS, CST, ADS, Allegro X APD, Xpedition, or equivalent) Ability to work independently and collaboratively in a cross-functional, research-driven environment Preferred Qualifications Experience with advanced packaging technologies (chiplets, 2.5D/3D integration, interposers) Familiarity with ADKs, PDKs, or design enablement concepts, including collaboration with EDA vendors Working knowledge of Python and/or Tcl for design automation, simulation support, or data analysisPCB design and technology (e.g., Altium or equivalent)