In this role as a Staff Mechanical Engineer – Technical Lead, you'll be at the forefront of designing next-generation optical pluggable modules. You'll collaborate within a dynamic team of skilled engineers, fostering an innovative environment where your expertise shapes breakthrough solutions. Your work will involve hands-on engineering, from simulations to prototyping, ensuring products meet industry standards. You'll enjoy a supportive culture that emphasizes professional growth and knowledge sharing. Benefits include a competitive salary, flexible work arrangements, health and wellness programs, and opportunities for continuous learning. Join us to make a meaningful impact on global connectivity while being supported by a collaborative and forward-thinking team. Design and develop mechanical components for optical pluggable modules, focusing on thermal, structural, and manufacturability aspects.Perform and supervise thermal simulations and finite element analysis (FEA) to optimize designs.Collaborate with system integration teams to create innovative die interconnect solutions exceeding 140GHz bandwidth.Create and review CAD models and detailed engineering drawings for precision manufacturing.Conduct tolerance and stress analyses, along with thermal design validation testing (DVT).Develop prototypes and facilitate the transition from design to production, minimizing redesign efforts.Engage with suppliers and contract manufacturers to troubleshoot mechanical and integration challenges.Author and review engineering change orders (ECOs), bill of materials (BOMs), and technical documentation. Must-Have:Bachelor’s or Master’s degree in Mechanical Engineering10+ years of experience in mechanical design, particularly with optical or telecom hardwareStrong expertise in thermal design, FEA, and CAD modeling (Creo preferred)Proficiency in conducting die stress/strain simulationsExcellent communication and leadership skillsNice-To-Have:Experience with optical transceiver packaging (e.g., QSFP, OSFP)Knowledge of compliance and shock/vibration testing for telecom applicationsFamiliarity with advanced substrate technologies like LTCC and HTCCExperience in new product introduction (NPI) processes