We are seeking an Optoelectronic Engineer to perform leading research and development in next-generation optoelectronic integration technologies enabling high-bandwidth electrical and optical interconnects, heterogeneous integration, and co-packaged optical systems. This role sits at the intersection of high-frequency electrical packaging, photonic integration, heterogeneous assembly, and advanced interconnect design. The successful candidate will define how EICs, PICs, advanced substrates, and optical interfaces are co-packaged to push the boundaries of performance and efficiency. The candidate will work directly with other Nokia Bell Labs researchers and Nokia business units to help define integration architectures, advanced substrates, and assembly processes for optical subassemblies. As part of Nokia Bell Labs, you will contribute to forward-looking research while shaping practical integration approaches for next-generation optical systems.The candidate will have expertise in the design and optimization of high-speed (>100 GHz) electrical and optical I/O, including EIC-PIC (driver-modulator and detector-TIA), substrate and package transitions, and optical interconnects (waveguides, couplers and fiber interfaces).The candidate will define and evaluate integration architectures for co-packaged and heterogeneous subsystems, including substrate materials, assembly techniques, and high-density electrical and optical routing strategies.The candidate will conduct high-frequency test and measurement, including network analysis and time-domain characterization, and have familiarity with wireline modulation formats (PAM, QAM).The candidate will work well and efficiently within a larger team with strong interpersonal skills and collaborate with other research groups in Nokia Bell Labs. You have:Ph.D. degree in Electrical Engineering, Applied Physics, or related field with minimum of 2 years of industry experience (or MSEE with 6 years)Experience with the design and characterization of high-speed optoelectronic interfaces (drivers/TIAs and detectors/modulators)Expertise in 3D EM design and Signal Integrity principles, including high-speed interconnect and transitions using EDA software (ANSYS HFSS, Keysight ADS) and Photonic simulation tools (ANSYS Lumerical FDTD, Mode)Knowledge of IC packaging materials and techniques (wire-bond and flip-chip), substrate design, and microelectronics assembly process flowsKnowledge of high-speed test and measurement equipment (network analyzer, oscilloscope)Strong technical writing skills for publicationIt would be nice if you also had:Experience with heterogeneous integration or co-packaged optics (CPO)Familiarity with EIC (SiGe, RFSOI) and/or PIC platforms (InP, SiPh, TFLN) Understanding of optical coupling structures (grating, evanescent)Experience with scripting/automation (Python, MATLAB)