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Principal Mechanical HW Development Engineer

Nokia

Principal Mechanical HW Development Engineer

full-timePosted: Jun 26, 2026Updated: Sep 3, 2026United States

Job Description

As a Principal Mechanical Engineer at Nokia, you'll work on innovative projects that push the boundaries of telecommunications technology. Collaborating with cross-functional teams, you'll translate concepts into production-ready solutions, focusing on mechanical, thermal, and electrical integration. You'll have the opportunity to guide design initiatives, influence product features, and engage with both internal departments and external suppliers to streamline production processes. Nokia offers a dynamic work environment that fosters creativity and problem-solving. You'll benefit from professional development opportunities, flexible work arrangements, and a competitive compensation package. Join us in shaping the future of connectivity while enjoying a balanced work-life experience in a supportive culture that values collaboration and excellence. Drive mechanical and thermal design from product concept to production with minimal supervision.Define product features by balancing mechanical, electrical, and thermal considerations with customer needs.Research, design, and test mechanical parts to integrate features efficiently.Conduct tolerance, stress, and thermal analyses as required to ensure design integrity.Collaborate with manufacturing and suppliers to source parts and assemblies effectively.Manage design verification testing (DVT) for new and existing projects, providing support as needed.Create comprehensive documentation for all designs and ensure smooth transition of new designs to production.Coordinate efforts across teams and external services to enhance project outcomes. Must-Have:Bachelor's or Master's degree in Mechanical Engineering (BSME, MSME preferred)Minimum of 10 years' experience in designing Telecom networking productsProficient in CREO for mechanical design/modeling and Windchill PLM managementExperience in the design of high-powered densely packed circuit packsExperience in the design of sheet metal chassis, fan tray, pluggable modules, and fiber managementExperience with tolerance analyses, shock and vibration testingStrong understanding of NEBS, ETSI, and ANSI requirementsNice-To-Have:Experience in thermal modeling using FloTherm or AnsysExperience using Agile for ECOs and BOM managementExperience with heat sink design and other cooling systemsExpertise in acoustic attenuation and materials selectionKnowledge of optical pluggable component designDesign emphasis on fiber management and injection molded plasticsFluency in additional languages

Locations

  • United States
  • Infinera San Ignacio Av FAB 2.0

Skills Required

  • designing Telecom networking productsintermediate
  • CREO for mechanical design/modelingintermediate
  • design of high-powered densely packed circuit packsintermediate
  • design of sheet metal chassisintermediate
  • tolerance analysesintermediate
  • thermal modeling using FloThermintermediate
  • Agile for ECOsintermediate
  • heat sink designintermediate
  • acoustic attenuationintermediate
  • optical pluggable component designintermediate
  • additional languagesintermediate

Required Qualifications

  • Bachelor's or Master's degree in Mechanical Engineering (BSME, MSME preferred) (degree in master)
  • Minimum of 10 years' experience in designing Telecom networking products (experience, 10 years)
  • Proficient in CREO for mechanical design/modeling and Windchill PLM management (experience)
  • Experience in the design of high-powered densely packed circuit packs (experience)
  • Experience in the design of sheet metal chassis, fan tray, pluggable modules, and fiber management (experience)
  • Experience with tolerance analyses, shock and vibration testing (experience)
  • Strong understanding of NEBS, ETSI, and ANSI requirements (experience)
  • Experience in thermal modeling using FloTherm or Ansys (experience)
  • Experience using Agile for ECOs and BOM management (experience)
  • Experience with heat sink design and other cooling systems (experience)
  • Expertise in acoustic attenuation and materials selection (experience)
  • Knowledge of optical pluggable component design (experience)
  • Design emphasis on fiber management and injection molded plastics (experience)
  • Fluency in additional languages (experience)

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