As a Principal PIC Process Development Engineer, you will be a senior individual contributor within Nokia’s Optical Components organization, responsible for the development, optimization, and transfer of InP photonic integrated circuit (PIC) and laser fabrication processes for high‑volume manufacturing.This role requires deep technical expertise across epitaxial design, semiconductor processing, data‑driven manufacturing analysis, and close collaboration with remote fabrication partners. You will play a key role in enabling next‑generation optical component technologies that support Nokia’s high‑capacity optical networking platforms. NION2026 Process Development & IntegrationLead the design, development, and optimization of InP PIC and laser fabrication processes for high‑volume manufacturingDesign and specify epitaxial layer structures in collaboration with device designers and epitaxy suppliersDevelop complete fabrication process flows based on design requirements, tool capabilities, and manufacturing constraintsDrive process integration, ensuring compatibility across metal, semiconductor, and dielectric modulesManufacturing Data & Yield ExcellencePerform extensive data analysis of photonic device, wafer, and process data in a manufacturing environmentApply SPC, process capability analysis (Cp/Cpk), and statistical methods to monitor and improve process performanceLead or contribute to FMEA activities, root cause analysis, and corrective actions for yield and reliability issuesDefine and utilize metrology strategies to ensure robust process controlFab Execution & Cross‑Functional CollaborationShepherd wafers successfully through the fab, coordinating closely with test, development, integration, and fabrication engineersAct as a senior technical interface with external or remote fabrication facilities, ensuring alignment on process execution and prioritiesCollaborate with device design, product engineering, and reliability teams to support technology readiness and product rampTechnical Leadership & ImpactProvide technical leadership within the PIC process development domainContribute to continuous improvement of tools, methods, and best practicesMentor junior engineers and support knowledge transfer across the broader team Ph.D. in Electrical Engineering, Physics, or a related fieldMinimum 10 years of experience developing and characterizing materials and devices for optoelectronic applicationsDeep expertise in: PIC device physicsSemiconductor, metal, and dielectric materials properties, characterization methods, and data interpretationOpto‑electronic testing of PIC devicesModeling, simulation, scripting, and working with large, complex data setsPhysics‑based and data‑driven root cause analysisDemonstrated ability to drive cross‑functional engineering teams to measurable outcomesExcellent communication and organizational skillsPreferred QualificationsExperience supporting technology transfer to high‑volume manufacturingFamiliarity with yield ramp, qualification, and reliability testing for photonic devicesStrong communication skills with the ability to translate complex technical issues across disciplinesExperience working in foundry or captive fab environments supporting compound semiconductor technologies