Job Description

Locations

• United States
• Infinera Bordeaux Dr

Required Qualifications

• At least 2 years of experience working in a modern semiconductor fab which places a high premium on quality.Understanding of semiconductor processes and device physicsUnderstanding of statistical process control methodsFamiliarity with or direct experience in most of the standard semiconductor process technologies required for wafer fabrication such as epitaxy, wet etching, plasma etching, metal deposition, and photolithographyStrong focus on quality and attention to detailEager to learn and expand skill setStrong follow-up skills and problem-solving ability and driveTakes ownership for tasks and projectsTeam-player with good communication skills, verbal and writtenAbility to organize data and keep track of several simultaneous projects and deadlines (experience, 2 years)
• Understanding of semiconductor processes and device physics (experience)
• Understanding of statistical process control methods (experience)
• Familiarity with or direct experience in most of the standard semiconductor process technologies required for wafer fabrication such as epitaxy, wet etching, plasma etching, metal deposition, and photolithography (experience)
• Strong focus on quality and attention to detail (experience)
• Eager to learn and expand skill set (experience)
• Strong follow-up skills and problem-solving ability and drive (experience)
• Takes ownership for tasks and projects (experience)
• Team-player with good communication skills, verbal and written (experience)
• Ability to organize data and keep track of several simultaneous projects and deadlines (experience)
• B.S. or higher in Electrical Engineering, Photonics, Physics, or Materials Science with at least 2 years of semiconductor fab experience. (experience, 2 years)

Responsibilities

• Troubleshoot challenging performance and yield issues in the wafer fabInvestigate the reason and root cause for lots being put on holdProvide support for engineers with failure analysis – visual inspections, CD-SEM work, electrical IV sweeps, profilometer depth measurements, etc.Use Manufacturing Engineering System (MES) software to help with integration engineering activities – collect data, perform basic data analysis, generate Power Point reports, etc.Routine review of SPC charts and initial response for out-of-control eventsCoordinate and follow movement of qual and development lots through fab, assembly, and test areasManage quality and yield of PIC wafers based on knowledge of fab processes, device physics, and the analysis of test and reliability dataTroubleshoot and resolve process deviations and test failures through a detailed analysis of test data and process historyEstablish and maintain inline FAB process specifications.Support Process Engineering to improve process stability and capabilitySupport Operations to improve throughput and cycle timeSupport next-generation PIC platform development and participate in technology development, transfer, and ramp activities to meet yield, reliability and device performance goalsHelp to assure compliance with PIC product quality system
• Troubleshoot challenging performance and yield issues in the wafer fab
• Investigate the reason and root cause for lots being put on hold
• Provide support for engineers with failure analysis – visual inspections, CD-SEM work, electrical IV sweeps, profilometer depth measurements, etc.
• Use Manufacturing Engineering System (MES) software to help with integration engineering activities – collect data, perform basic data analysis, generate Power Point reports, etc.
• Routine review of SPC charts and initial response for out-of-control events
• Coordinate and follow movement of qual and development lots through fab, assembly, and test areas
• Manage quality and yield of PIC wafers based on knowledge of fab processes, device physics, and the analysis of test and reliability data
• Troubleshoot and resolve process deviations and test failures through a detailed analysis of test data and process history
• Establish and maintain inline FAB process specifications.
• Support Process Engineering to improve process stability and capability
• Support Operations to improve throughput and cycle time
• Support next-generation PIC platform development and participate in technology development, transfer, and ramp activities to meet yield, reliability and device performance goals
• Help to assure compliance with PIC product quality system

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