As a DFAB Inspector at Nokia, you will play a crucial role in maintaining our commitment to quality by screening PICs and CoCs before they progress down the production line. Your meticulous attention to detail will ensure our products uphold Nokia’s renowned standards. This unique position allows you to witness the fascinating transformation of optoelectronics from die level to final assembly, providing insight into the cutting-edge technology that drives our innovations. Join us in shaping the future and consistently delivering excellence in every aspect of our work! This position is for shift 7. Shift 7 is 6:00 PM to 6:00 AM, Friday - Sunday and every other Thursday. Conduct detailed inspections of parts under a high-power microscope to identify and document defects, ensuring the highest quality standards for Photonic Integrated Circuits (PICs) and assembled components.Accurately label scrapped parts in the Manufacturing Execution System (MES) to maintain precise inventory and quality control.Collaborate with cross-functional teams to address and fulfill various inspection and quality requests, fostering a cooperative work environment.Provide constructive feedback on quality observations to drive continuous improvement processes within the team and organization.Utilize precision tools, including small tweezers, for meticulous handling and sorting of small parts, emphasizing attention to detail.Embrace a dynamic work environment, leveraging your self-motivation and effective communication skills to contribute positively to team performance.Explore opportunities for career advancement in the optoelectronics field through hands-on experience and professional development initiatives at Nokia.Experience the thrill of solving complex quality challenges while contributing to innovative technology that shapes the future of communication. Must-Have:Strong attention to detailAbility to work independentlySound judgment and decision-making skillsEffective communication abilitiesBasic computer proficiency Nice-To-Have:Familiarity with die defectsExperience using a high-power microscopeKnowledge of wirebond and die attach defects