As an Senior Hardware Development Engineer, you will play a crucial role in our team, focusing on structural and thermo-mechanical simulations for optical transceiver products. Your expertise will be instrumental in identifying structural risks, optimizing designs, and ensuring product reliability throughout its lifecycle. This role offers an exciting opportunity to work with cutting-edge technology and contribute to the development of innovative optical solutions.NILightpath Own structural and thermo-mechanical simulations for high-speed optical transceiver products, including OSFP, QSFP-DD, and future form factors. Ensure product robustness by identifying structural risks early in the design cycle and proposing mitigation plans. Work closely with cross-functional teams, including mechanical, thermal, optics, electronics, and reliability experts, to define critical parameters and drive design optimization. Develop detailed finite element models of module housings, heat sinks, optical assemblies, PCBAs, and other critical components. Participate in design and product gate reviews, providing structural and reliability sign-offs to ensure product quality and performance. Correlate simulation results with physical testing, including mechanical shock, drop, vibration, and thermal cycling, to validate product reliability. Support qualification and regulatory testing activities, performing root-cause analysis for field and validation failures. Develop simulation methodologies, best practices, and design guidelines to enhance efficiency and consistency in the simulation process. Evaluate new materials, manufacturing methods, and packaging technologies to stay at the forefront of industry advancements. Foster a culture of innovation by developing reusable simulation templates, automation workflows, and establishing FEA processes. B.E./B.Tech./M.E./M.Tech. in Mechanical Engineering or equivalent, with 5+ years of experience in FEA and structural reliability engineering.Strong expertise in FEA software, including Abaqus, ANSYS Workbench, ANSYS Mechanical, LS-Dyna, and HyperMesh.Proficiency in linear and non-linear structural analysis, contact non-linearity, material non-linearity, geometric non-linearity, and large deformation analysis.Experience with reliability simulations, including drop simulations, mechanical shock analysis, modal analysis, and fatigue assessments.Knowledge of optical transceiver architecture, OSFP and QSFP-DD mechanical standards, and high-density packaging constraints.Working knowledge of Creo or equivalent CAD tools, with experience in GD&T interpretation, tolerance analysis, and component design.Understanding of manufacturing and assembly processes, and experience with optical modules, optics packaging, or compact electronics products is preferred.Excellent communication and technical presentation skills, with the ability to collaborate effectively in a cross-functional environment.Proven track record of delivering products from concept to production release, demonstrating strong analytical and problem-solving abilities.Passion for continuous learning and staying updated with industry trends and advancements in FEA and structural reliability engineering.