As a Staff PIC Process Development Engineer, you will be a senior individual contributor within Nokia’s Optical Components organization, responsible for the development, optimization, and transfer of InP photonic integrated circuit (PIC) and laser fabrication processes for high‑volume manufacturing.This role requires deep technical expertise across epitaxial design, semiconductor processing, data‑driven manufacturing analysis, and close collaboration with remote fabrication partners. You will play a key role in enabling next‑generation optical component technologies that support Nokia’s high‑capacity optical networking platforms. Process Development & IntegrationLead the design, development, and optimization of InP PIC and laser fabrication processes for high‑volume manufacturingDesign and specify epitaxial layer structures in collaboration with device designers and epitaxy suppliersDevelop complete fabrication process flows based on design requirements, tool capabilities, and manufacturing constraintsDrive process integration, ensuring compatibility across metal, semiconductor, and dielectric modulesManufacturing Data & Yield ExcellencePerform extensive data analysis of photonic device, wafer, and process data in a manufacturing environmentApply SPC, process capability analysis (Cp/Cpk), and statistical methods to monitor and improve process performanceLead or contribute to FMEA activities, root cause analysis, and corrective actions for yield and reliability issuesDefine and utilize metrology strategies to ensure robust process controlFab Execution & Cross‑Functional CollaborationShepherd wafers successfully through the fab, coordinating closely with test, development, integration, and fabrication engineersAct as a senior technical interface with external or remote fabrication facilities, ensuring alignment on process execution and prioritiesCollaborate with device design, product engineering, and reliability teams to support technology readiness and product rampTechnical Leadership & ImpactProvide technical leadership within the PIC process development domainContribute to continuous improvement of tools, methods, and best practicesMentor junior engineers and support knowledge transfer across the broader team Ph.D. in Electrical Engineering, Physics, or a related fieldMinimum 3 years of industry experience developing and manufacturing InP PIC or laser fabrication processes for high‑volume applicationsDemonstrated expertise in: Design of epitaxial layer structuresProcess design and fabrication process development for InP devices or PICsPhotonic device data query and analysis in a manufacturing environmentMetal, semiconductor, and dielectric deposition and etching tools, chemistries, and methodsFMEA, SPC, process capability, and metrologyBuilding end‑to‑end fabrication process flows from tool and design specificationsProven ability to work effectively with remote fabs and cross‑site teams Preferred QualificationsExperience supporting technology transfer to high‑volume manufacturingFamiliarity with yield ramp, qualification, and reliability testing for photonic devicesStrong communication skills with the ability to translate complex technical issues across disciplinesExperience working in foundry or captive fab environments supporting compound semiconductor technologies