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Senior Board Design Engineer, Electro Optical

NVIDIA

Senior Board Design Engineer, Electro Optical

full-timePosted: Aug 4, 2026Updated: Aug 27, 2026Yokneam, Israel

Job Description

The company's Advanced Research (ARG) team in Yokneam is looking for a Senior Electro-Optical / Board Design Engineer for research and development. The ARG group is doing research and development of next-generation electro-optical devices and EO sub-systems for high-speed communication. Our solutions include laser diodes, photo-diodes, modulators, and electronics for use in optoelectronics. The selected candidate would work as part of a multi-disciplinary team, composed of engineers and researchers, supporting the development of future components and systems, for current and next generations. What you’ll be doing:Take part in research and development of next-generation electro-optical devices and EO sub-systems for high-speed communication.The candidates tasks will include electrical specification of EO sub-systems and evaluation boards, schematic design, component selection and characterization, layout considerations and implementation, Fabrication and Assembly guidance.Hands-on development and testing within Data Center interconnect lab environment. What we need to See:B.Sc./M.S.c.in Electrical Engineering or Practical Engineer certificate or equivalent experience.10+ years experience with electro-optical and High-Speed Board Design.Strong background in high-frequency and broadband (>20GHz) design.Strong system-level understanding.Background in thermal and mechanical design considerations.Good SI/PI understanding in perspective of multi-layer PCB design.Experience in electro-optical and High-Speed lab environment – High-end measurements.Knowledge of electro-optical components: Drivers, CDR, Gearbox, DSP, Lasers, Detectors, Amplifiers…etc.Strong abilities to work as part of a team. Highly motivated. Ways to stand out from the crowd:Design and knowledge with Data-Center environment [Switches/CPU/DPU/GPU]Experience in layout extraction and board-level simulation.Knowledge with board-design tools (Cadence environment).Familiar with NRZ/PAM-4 signaling schemes as well as familiar with various communication protocols: SPI, I2C, SerDes, PCIe, Ethernet.Previous experience as a technician\Practical Engineer at IDF technology units.

Locations

  • Yokneam, Israel

Responsibilities

  • Take part in research and development of next-generation electro-optical devices and EO sub-systems for high-speed communication.
  • The candidates tasks will include electrical specification of EO sub-systems and evaluation boards, schematic design, component selection and characterization, layout considerations and implementation, Fabrication and Assembly guidance.
  • Hands-on development and testing within Data Center interconnect lab environment.
  • Take part in research and development of next-generation electro-optical devices and EO sub-systems for high-speed communication.
  • The candidates tasks will include electrical specification of EO sub-systems and evaluation boards, schematic design, component selection and characterization, layout considerations and implementation, Fabrication and Assembly guidance.
  • Hands-on development and testing within Data Center interconnect lab environment.

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