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Senior Signal Integrity and PCB Quality Engineer

NVIDIA

Senior Signal Integrity and PCB Quality Engineer

full-timePosted: Aug 7, 2026Updated: Aug 27, 2026Shenzhen, China

Job Description

We are looking for a Senior Signal Integrity & PCB Quality Engineer!NVIDIA is powering the next wave of AI and accelerated computing, and our PCB technology is a critical enabler of the world's highest-performance systems. Join our SI team to ensure that every board we ship meets the most demanding signal integrity requirements — from early material research through high-volume manufacturing. You'll work at the intersection of electrical design, PCB fabrication science, and supplier quality, directly impacting products like DGX, MGX, and next-generation GPU/networking platforms.If you love solving complex signal integrity challenges and thrive on bridging the gap between design intent and manufacturing reality, we want to hear from you. What You'll Be Doing:Define board and system level SI requirements with emphasis on PCB impedance control, insertion loss budgets, and high-speed channel performanceLead SI/PI design activities including PCB stackup definition, laminate/prepreg material selection, via impedance optimization, and design reviewEvaluate and qualify new PCB materials through characterization test vehicles, analyzing Dk, Df, surface roughness, and copper foil properties across frequencyCollaborate with PCB fabrication suppliers to establish and monitor SI quality metrics — including trace geometry (H1/H2/W/T), impedance, and insertion loss — for both NPI and mass production buildsDevelop and maintain statistical process control frameworks for PCB fab impedance and IL data; identify trends, excursions, and root causesConduct PCB supplier audits to verify process capability, compliance with NVIDIA specifications, and continuous improvement initiativesPartner with cross-functional teams (layout, mechanical, reliability, procurement) to balance SI performance with manufacturing feasibility, cost, and reliabilityContribute to PCB technology roadmap development, evaluating emerging materials and fabrication processes for next-generation products What We Need to See:BS or MS in Electrical Engineering, Materials Science, Chemical Engineering, or a related field, with 5+ years of relevant experience in PCB SI or PCB fabricationStrong foundation in electromagnetics, transmission line theory, and high-frequency signal propagation (skin effect, dielectric loss, dispersion)Experience with 3D/2D EM simulation tools such as HFSS, Q2D, Ansys SIwave, or Polar impedance calculatorsHands-on experience with lab measurement equipment including VNA and TDR for impedance and insertion loss characterizationWorking knowledge of PCB fabrication processes: lamination, etching, plating, drilling, and their impact on electrical performanceAbility to analyze data, identify trends, and communicate findings clearly to both technical and non-technical stakeholdersEffective written and verbal communication skills in English Ways to Stand Out from the Crowd:Experience with advanced PCB materials and technologies (e.g., PTFE/HC laminates, HVLP4/5 copper foil, TLPS, embedded capacitors)Proficiency in Python, MATLAB, JMP, or similar tools for data analysis, automation, and statistical process monitoringFamiliarity with Delta-L or other de-embedding methodologies for material characterizationExperience managing supplier quality programs, including audit planning, corrective action tracking, and process capability studiesKnowledge of IPC standards relevant to PCB fabrication and testing. Track record of driving PCB technology improvements from R&D through high-volume manufacturing NVIDIA is widely considered one of the technology world's most desirable employers. We have some of the most forward-thinking and hardworking people in the world working for us. If you're excited about pushing the boundaries of PCB technology that enables the world's most powerful AI systems, come join us

Locations

  • Shenzhen, China

Responsibilities

  • Define board and system level SI requirements with emphasis on PCB impedance control, insertion loss budgets, and high-speed channel performance
  • Lead SI/PI design activities including PCB stackup definition, laminate/prepreg material selection, via impedance optimization, and design review
  • Evaluate and qualify new PCB materials through characterization test vehicles, analyzing Dk, Df, surface roughness, and copper foil properties across frequency
  • Collaborate with PCB fabrication suppliers to establish and monitor SI quality metrics — including trace geometry (H1/H2/W/T), impedance, and insertion loss — for both NPI and mass production builds
  • Develop and maintain statistical process control frameworks for PCB fab impedance and IL data; identify trends, excursions, and root causes
  • Conduct PCB supplier audits to verify process capability, compliance with NVIDIA specifications, and continuous improvement initiatives
  • Partner with cross-functional teams (layout, mechanical, reliability, procurement) to balance SI performance with manufacturing feasibility, cost, and reliability
  • Contribute to PCB technology roadmap development, evaluating emerging materials and fabrication processes for next-generation products

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