Job Summary:Daily tasks will include rebuilding and cleaning subassemblies for semiconductor manufacturing equipment, performing Preventative Maintenance (PM) tasks, support of subfab equipment, chemical handling, and ensuring an adequate supply of consumables for rebuilding sub-assemblies.Perform PM activities for the following tool sets: AMAT (DPSII, DPS, MxP, MxP+, IPS, Super E & 5200’s), Ulvac, Gasonics, Fusion Gemini & LAM (4400 & Coronus) Dry Etch tools.Candidate must possess good mechanical aptitude and troubleshooting abilities.Candidate must be detail oriented and able to create and follow written procedures.Candidate should have an understanding of electronic, mechanical, and vacuum systems.Strong verbal and written communication skills.Ability to interact professionally in a fast-paced production environment.Knowledge of 5S principles and experience maintaining 5S organization within maintenance or parts management environment.Job Qualifications:Minimum educational requirements are High School Diploma or Equivalent.2-3 years of previous equipment maintenance and/or parts management.Prefer 3 to 5 years of related wafer fab experience with an emphasis on production equipment.Prefer candidate to have greater than 12 hours towards an Associate degree in electronics from a recognized, accredited school.Microsoft Excel knowledge for data entry and trackingMore information about NXP in the United States...NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.#LI-97b2