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Die Attach Equipment Technician

NXP Semiconductors

Die Attach Equipment Technician

full-timePosted: Aug 2, 2026Updated: Sep 1, 2026Kuala Lumpur

Job Description

● Die Attach Equipment Technician specialist and vast experience working on Die Attach equipment such as Datacon 8800 FC QUANTUM is a must and preferable also have experience on Hanwha Die Attach equipments.● Maintain and repair Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment.● Perform equipment setup or conversion for any product changes for Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment.● To able to work independently to identify, sustain, purchase, find second source for Die Attach integrated critical spare and tooling.● To maintain/sustain equipment performance to meet define goal.● Improve FC Overall OEE, MTBA/MTBF, PM Effectiveness and Unscheduled Downtime.● To maintain the machine performance, address the problem root cause and solve quality issue cause by the machine.Compensation Details● Support production to meet weekly schedule targets through working either normal or shift hours when or where needed. This especially true weekends and public holidays.● Manage the maintenance activities of machines and fabrication of spare parts.● Good discipline and tardiness with minimum superviseRequirement● Diploma in Electrical & Electronics or Mechanical and Engineering discipline, or certificate with min 5 years’ of relevant working experience in Die Attach equipment● Experience in semiconductor assembly and applied statistics will be an advantage● Have good technical skills on Front and Back End assembly equipment● Strong interpersonal and communication skills● Good decision making / problem solving skills.● Familiar with production environment & possesses process handling knowledge. (Semiconductor).● Must be discipline and willing to work long hours and shifts.● Must adhere NXP Total Quality Mindset and Safety Awareness.● Must adhere NXP core value Trust and Respect, Collaboration, Ownership, Expertise, Innovation and Growth.#LI-DNI

Locations

  • Kuala Lumpur

Skills Required

  • Die Attach equipmentintermediate
  • semiconductor assemblyintermediate

Required Qualifications

  • ● Diploma in Electrical & Electronics or Mechanical and Engineering discipline, or certificate with min 5 years’ of relevant working experience in Die Attach equipment (experience, 5 years)
  • ● Experience in semiconductor assembly and applied statistics will be an advantage (experience)
  • ● Have good technical skills on Front and Back End assembly equipment (experience)
  • ● Strong interpersonal and communication skills (experience)
  • ● Good decision making / problem solving skills. (experience)
  • ● Familiar with production environment & possesses process handling knowledge. (Semiconductor). (experience)
  • ● Must be discipline and willing to work long hours and shifts. (experience)
  • ● Must adhere NXP Total Quality Mindset and Safety Awareness. (experience)
  • ● Must adhere NXP core value Trust and Respect, Collaboration, Ownership, Expertise, Innovation and Growth. (experience)

Benefits

  • general: ● Support production to meet weekly schedule targets through working either normal or shift hours when or where needed. This especially true weekends and public holidays.
  • general: ● Manage the maintenance activities of machines and fabrication of spare parts.
  • general: ● Good discipline and tardiness with minimum supervise

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