**Key Responsibilities**- Assist in establishing and maintaining the Die Bond process - Monitor daily production to ensure process stability, yield, and quality performance - Conduct root cause analysis (RCA) of process issues and implement corrective and preventive actions- Support new product introduction (NPI), including process setup, validation, and documentation - Optimize process parameters to improve yield, efficiency, and reliability - Collaborate with cross-functional teams (e.g., Production, Equipment, Quality, Innovation) - Analyze data and prepare process reports - Participate in continuous improvement projects (e.g., cost reduction, capacity increase) **Education & Qualifications**- Bachelor’s or Master’s degree in a related field, including: - Materials Science - Chemical Engineering - Mechanical Engineering - Electrical / Electronic Engineering - Basic knowledge of semiconductor packaging processes is preferred - Strong analytical and problem-solving skills - Good communication skills and a team-oriented mindset - English proficiency: TOEIC score of 650 or above, or equivalent certification More information about NXP in Greater China...#LI-2370