Hiring: External Package Innovation EngineerWe are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution.🔹 Role OverviewAs an EPI engineer, you will act as both a Role Owner and Key Supporter for OSAT-related development activities, ensuring robust execution from concept through production.🔹 Key Responsibilities✅ 1. Role Owner (Strategic & Governance)Own and lead OSAT-wide and cross-OSAT initiativesDefine and deploy standard development templates and success criteria across OSATsDrive deployment of Best Known Methods (BKM) and lessons learnedDevelop and maintain technology roadmap and capability assessment for each OSAT siteProvide Package Innovation (PI) input for:External site sourcing strategySite selection process (jointly with interface manager)Lead project governance, including:Overall project summariesStoplight reportingRegular reviews per OSAT site✅ 2. Supporter (Execution & Project Delivery)Support NPI & NTI projects executed at external OSAT factoriesEnsure OSAT compliance with:Development processesRequired documentation/templatesDrive alignment on SME (Subject Matter Expert) assignment at OSATSupport and resolve technical and project issues on-site and across time zonesEnsure assembly readiness and safe production launch🔹 Stakeholder CollaborationYou will work closely with cross-functional teams, including:Project Leaders & Development ManagersDesigners & Materials EngineersTech Integration & Modelling teams (Electrical, Mechanical, Thermal)API and WLP/PLP/FC SMEsOSAT partners🔹 What We’re Looking ForStrong experience in semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding). Previous exposure to OSAT ecosystem is an added advantage.Proven ability to manage cross-site, cross-functional projectsSolid understanding of NPI/NTI development flowsExcellent stakeholder management and communication skillsAbility to drive standardization, governance, and technical problem-solving🌟 Why Join UsOpportunity to lead high-impact package innovation initiativesWork with global teams and OSAT partners for wide exposure and fast knowledge & skill growthDrive technology roadmap and next-generation packaging solutionsMore information about NXP in Malaysia...#LI-633a