Failure Analysis Engineer
NXP Semiconductors
Failure Analysis Engineer
Job Description
As a Failure Analysis Engineer at NXP Semiconductors, you will play a crucial role in ensuring the quality and reliability of our cutting‑edge semiconductor products. You will be responsible for investigating and identifying the root causes of device failures, directly contributing to product improvement and customer satisfaction.Job ResponsibilitiesPerform detailed electrical failure analysis on advanced semiconductor devices, including microcontrollers, processors, and analog circuits.Utilize a wide range of analytical techniques and equipment such as SEM/EDX, OBIRCH, emission microscopy, and various electrical fault‑isolation and debug tools.Develop and implement new failure analysis methodologies and techniques to address emerging technologies and failure modes.Collaborate closely with design, product, test, and reliability engineering teams to provide timely and accurate failure analysis reports and corrective actions.Document analysis results thoroughly, including detailed observations, conclusions, and recommended solutions.Participate in cross‑functional teams to drive continuous improvement in product quality, manufacturing processes, and design.Provide technical expertise and mentorship to junior engineers and technicians.Stay up to date with the latest advancements in failure analysis technologies and semiconductor device physics.Job QualificationsBachelor’s, Master’s, or Ph.D. in Electrical Engineering, Electronic Engineering, Materials Science, Physics, or a related field.Proven experience (2+ years) in semiconductor failure analysis within a high‑volume manufacturing or R&D environment.Strong theoretical and practical knowledge of semiconductor device physics, processing, and packaging technologies.Hands‑on experience with a broad range of failure analysis tools and techniques (SEM/EDX, PEM, LIT, OBIRCH, LVP/EOP, etc.).Proficiency in electrical debug and characterization techniques, including curve tracing, logic analysis, and oscilloscope operation.Excellent problem‑solving skills and a methodical approach to root‑cause analysis.Strong written and verbal communication skills, with the ability to present complex technical information clearly and concisely.Ability to work effectively in a collaborative, fast‑paced environment.Experience with statistical analysis tools and methodologies is a plus.Fresh graduates with strong fundamentals and a passion for failure analysis are also encouraged to apply.More information about NXP in Malaysia...#LI-633a
Locations
- Kuala Lumpur
Skills Required
- semiconductor device physicsintermediate
- broad range of failure analysis toolsintermediate
- electrical debugintermediate
- statistical analysis toolsintermediate
Required Qualifications
- Bachelor’s, Master’s, or Ph.D. in Electrical Engineering, Electronic Engineering, Materials Science, Physics, or a related field. (degree in ph)
- Proven experience (2+ years) in semiconductor failure analysis within a high‑volume manufacturing or R&D environment. (experience, 2 years)
- Strong theoretical and practical knowledge of semiconductor device physics, processing, and packaging technologies. (experience)
- Hands‑on experience with a broad range of failure analysis tools and techniques (SEM/EDX, PEM, LIT, OBIRCH, LVP/EOP, etc.). (experience)
- Proficiency in electrical debug and characterization techniques, including curve tracing, logic analysis, and oscilloscope operation. (experience)
- Excellent problem‑solving skills and a methodical approach to root‑cause analysis. (experience)
- Strong written and verbal communication skills, with the ability to present complex technical information clearly and concisely. (experience)
- Ability to work effectively in a collaborative, fast‑paced environment. (experience)
- Experience with statistical analysis tools and methodologies is a plus. (experience)
- Fresh graduates with strong fundamentals and a passion for failure analysis are also encouraged to apply. (experience)
- More information about NXP in Malaysia... (experience)
Responsibilities
- Perform detailed electrical failure analysis on advanced semiconductor devices, including microcontrollers, processors, and analog circuits.
- Utilize a wide range of analytical techniques and equipment such as SEM/EDX, OBIRCH, emission microscopy, and various electrical fault‑isolation and debug tools.
- Develop and implement new failure analysis methodologies and techniques to address emerging technologies and failure modes.
- Collaborate closely with design, product, test, and reliability engineering teams to provide timely and accurate failure analysis reports and corrective actions.
- Document analysis results thoroughly, including detailed observations, conclusions, and recommended solutions.
- Participate in cross‑functional teams to drive continuous improvement in product quality, manufacturing processes, and design.
- Provide technical expertise and mentorship to junior engineers and technicians.
- Stay up to date with the latest advancements in failure analysis technologies and semiconductor device physics.
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