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FE ASSY DIE BOND PROCESS TECHNICIAN

NXP Semiconductors

FE ASSY DIE BOND PROCESS TECHNICIAN

full-timePosted: Aug 20, 2026Updated: Sep 1, 2026Kuala Lumpur

Job Description

Key Responsibilities: 1.Perform die bond process task on quality hold material2.Collaborate with equipment & manufacturing team to improve DB processes and techniques.3.Assist in resolving DB-related issues to minimize production downtime. Requirements: 1.Diploma or above in Engineering or a related field.2.Working experience with DB process is preferable and recommended.3.Strong attention to detail and technical troubleshooting skills.#LI-DNI

Locations

  • Kuala Lumpur

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