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Photo/Metrology Equipment Engineer ECHO Fab

NXP Semiconductors

Photo/Metrology Equipment Engineer ECHO Fab

full-timePosted: Aug 2, 2026Updated: Sep 1, 2026Chandler (Office)

Job Description

Equipment Engineering Role in ECHO Fab: Skills in Equipment Knowledge and Understanding; Safety & Compliance; Problem‑Solving Systems (WSS, troubleshooting trees); Root Cause Analysis; Equipment Fundamentals; Managing Sustaining Metrics (availability, alarms, scrap); OEE System Thinking; Escalation Discipline; FDC / Advanced Analytics & Scripting; FMEA / DFMEA Facilitation MTBF / MTTR Analysis; Tool Acceptance & Automation / MES Familiarity; Standard Work & 5S; Results Orientation / KPIs Mindset; Written/Verbal Communication Skills; Influencing up/down & Stakeholder Alignment; Vendor / Partner Management; Audit & Customer‑Facing Presence; Cost Literacy; Coaching; Prioritization; Delegation; Collaboration & Teamwork; Bias for Action with Rigor; Adaptability & Learning Mindset; Manage Ambiguity; Material Science Fundamentals.Primary Responsibilities: Responsible for multiple processes and tool ownership in a high-volume manufacturing facilityIdentify and reduce sources of variation, implementing zero defect processes, reducing defectivity, defining tool qualification/PM procedures, improving tool utilization and availability, reducing cycle time, identifying, and qualifying new tools, and supporting development or transfer activities.Sustaining – lead troubleshooting efforts, manage critical part inventory, direct supplier activities, responsive to SPC/ FDC excursions, writing specifications, training maintenance techs…Improving – forming/executing plans for continuous improvements, implementing hardware/software upgrades, developing preventative actions to SPC/ FDC excursions…Expanding – increasing tool capabilities/throughput/availability, determining new sourcing for parts/service/toolsets, installation/qualification of new equipment/componentsQualifications:Bachelor’s degree or higher in a technical discipline is required, prefer mechanical or industrial engineering or similar.Experience in one of the following area’s Photo, Metrology or Plating tools PreferredManufacturing experience (semiconductor preferred) in process or equipment engineering over a variety of toolsets.Ability to interact professionally with manufacturing and process engineering to effectively understand problems and efficiently resolve them.Ability to generate, analyze, and interpret equipment performance data and produce a timely action plan to resolve recurring equipment failures.Demonstrated presentation skills with ability to present complex datasets and equipment problems/ solutions to diverse audiences.Competent in troubleshooting problems and capable of applying logic to identify and technical skills to understand actions needed to implement/verify the repair.Ability to deal with multiple issues and shifting priorities.Strong verbal and written communication skills. Candidate will be called upon to train others and write clear procedures.Self-motivated; able to take initiative and effectively prioritize work for self.Participating in and/or leading cross-functional teams fostering collaboration to achieve a specific goal.A strong desire to help create a positive, winning, world class working environment.Safety and Quality minded approach and work habitMust be able to obtain and maintain an Export Control ClearanceMore information about NXP in the United States...NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.#LI-97b2

Locations

  • Chandler (Office)

Skills Required

  • one of the following area’s Photointermediate

Required Qualifications

  • Bachelor’s degree or higher in a technical discipline is required, prefer mechanical or industrial engineering or similar. (degree in higher in a technical discipline is required)
  • Experience in one of the following area’s Photo, Metrology or Plating tools Preferred (experience)
  • Manufacturing experience (semiconductor preferred) in process or equipment engineering over a variety of toolsets. (experience)
  • Ability to interact professionally with manufacturing and process engineering to effectively understand problems and efficiently resolve them. (experience)
  • Ability to generate, analyze, and interpret equipment performance data and produce a timely action plan to resolve recurring equipment failures. (experience)
  • Demonstrated presentation skills with ability to present complex datasets and equipment problems/ solutions to diverse audiences. (experience)
  • Competent in troubleshooting problems and capable of applying logic to identify and technical skills to understand actions needed to implement/verify the repair. (experience)
  • Ability to deal with multiple issues and shifting priorities. (experience)
  • Strong verbal and written communication skills. Candidate will be called upon to train others and write clear procedures. (experience)
  • Self-motivated; able to take initiative and effectively prioritize work for self. (experience)
  • Participating in and/or leading cross-functional teams fostering collaboration to achieve a specific goal. (experience)
  • A strong desire to help create a positive, winning, world class working environment. (experience)
  • Safety and Quality minded approach and work habit (experience)
  • Must be able to obtain and maintain an Export Control Clearance (experience)
  • More information about NXP in the United States... (experience)

Responsibilities

  • Responsible for multiple processes and tool ownership in a high-volume manufacturing facility
  • Identify and reduce sources of variation, implementing zero defect processes, reducing defectivity, defining tool qualification/PM procedures, improving tool utilization and availability, reducing cycle time, identifying, and qualifying new tools, and supporting development or transfer activities.
  • Sustaining – lead troubleshooting efforts, manage critical part inventory, direct supplier activities, responsive to SPC/ FDC excursions, writing specifications, training maintenance techs…
  • Improving – forming/executing plans for continuous improvements, implementing hardware/software upgrades, developing preventative actions to SPC/ FDC excursions…
  • Expanding – increasing tool capabilities/throughput/availability, determining new sourcing for parts/service/toolsets, installation/qualification of new equipment/components

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