Competitive Analysis Intern – Package InnovationRole SummarySupport the Package Innovation (PI) team in building competitive intelligence through structured analysis of semiconductor packaging technologies, market trends, and competitor activities.Key ResponsibilitiesPerform structured data mining of competitor product releases, PCNs, teardown reports, and technology announcementsDevelop insights on packaging trends, cost/performance positioning, and technology differentiationConduct startup and emerging technology evaluations relevant to advanced packagingConsolidate findings into clear, executive-ready reports and dashboards for PI leadershipMaintain and enhance competitive analysis databases and tracking frameworksAdditional ExposureParticipate in ATKL manufacturing projects to gain foundational understanding of semiconductor assembly processesQualificationsDegree candidate in Materials Science, Mechanical, Electrical Engineering, or related fieldStrong analytical mindset with ability to synthesize large datasets into actionable insightsProficient in Excel and PowerPoint; data analysis or visualization experience preferredFamiliarity with AI tools and advanced search techniques for efficient data mining is highly desiredStrong communication skills with ability to clearly present findingsMore information about NXP in Malaysia...#LI-633a