Utilize a wide variety of sample preparation techniques and imaging tools, including but not limited to chemical processing, die extraction, die physical polishing, RIE, MIP, X-Prep, cross-sectioning, wire bonding, repackaging, ion polishing, SEM/EDX, and backside IR.Operate precision milling/polishing systems and Reactive Ion Etching (RIE) systems for high-precision, site-specific sample preparation for package-level electrical FA (EFA) and die-level physical FA (PFA).Perform die extraction for various package types and execute layer-by-layer polishing at the die level.Conduct sample preparation through grinding/polishing, chemical processing, and repackaging techniques.Document analysis results thoroughly, including detailed observations, conclusions, and recommended corrective actions.Contribute to the development of new FA techniques, methodologies, and recipes, as well as tool evaluation projects to support emerging technologies.Demonstrate a strong understanding of semiconductor manufacturing processes.Job QualificationsBachelor’s or Master’s degree in Materials Science, Physics, Analytical Chemistry, or a related field.Proven experience (3+ years) in a semiconductor manufacturing or R&D environment; Wafer Fab experience is a plus.Hands-on experience with a broad range of FA sample preparation tools and techniques.Strong theoretical and practical knowledge of semiconductor device processing and packaging technologies.More information about NXP in Malaysia...#LI-633a