Job SummaryWe are seeking an experienced Sr. Principal Semiconductor Device Engineer to lead technology enablement in NXP in close collaboration with leading semiconductor foundries.This role requires deep expertise in device physics, advanced node technologies, and silicon validation, combined with the ability to drive cross-functional programs and influence external partners. You will play a key role in defining device requirements, guiding technology development, and ensuring successful product execution from concept through high-volume manufacturing.Key ResponsibilitiesTechnology Leadership & Device StrategyDefine and drive device architecture, scaling strategies, and performance targets for advanced FinFET technologiesLead device-level tradeoff analysis (performance, power, variability, reliability) across technology nodesProvide technical leadership in design-technology co-optimization (DTCO) and influence product architecture decisionsShape long-term device roadmap in alignment with product and foundry capabilitiesFoundry Engagement & Technology EnablementAct as the primary technical interface with external foundries (e.g., TSMC, Samsung)Drive alignment on PDKs, device models, design rules, and process changesNegotiate and influence device/process optimization strategies with foundry partnersLead periodic technical reviews (QTR/QBR) and escalation for yield or performance issuesSilicon Analysis, Yield & Performance OptimizationLead silicon validation and correlation (SPICE-to-silicon, TCAD-to-silicon)Drive parametric yield improvement, variability reduction, and failure analysisIdentify root causes of performance/reliability issues and define corrective actionsGuide teams on statistical analysis, DOE strategy, and data interpretationCross-Functional Collaboration & ExecutionLead collaboration across device, process integration, circuit design, reliability, and product teamsProvide technical direction for test structures, characterization plans, and design enablementSupport tape-out readiness, product bring-up, and qualificationMentor junior engineers and provide technical leadership across global teamsProgram & Stakeholder LeadershipDrive complex, multi-site programs with external foundries and internal stakeholdersCommunicate technical results and recommendations to executive leadership and partnersBalance technical risk, schedule, and business priorities to enable successful product deliveryRequired QualificationsEducationPhD in Electrical Engineering, Physics, Materials Science, or related field(MS with extensive experience also considered)Experience8–12+ years of experience in semiconductor device engineering, technology development, or process integrationProven track record in advanced CMOS/FinFET nodes (e.g., ≤16nm or equivalent complexity)Demonstrated experience working with external semiconductor foundries in development and/or productionTechnical ExpertiseDeep understanding of semiconductor device physics and transistor behaviorStrong background in: FinFET device architecture and scaling challengesDevice characterization (DC/AC), compact modeling, and variabilityYield analysis, failure analysis, and reliability physicsSPICE, TCAD, and data analysis toolsExperience with: PDK/device model validationSilicon debug and correlationDOE and statistical analysis methodologiesPreferred QualificationsExperience with 16nm and below nodes or emerging device architectures (e.g., GAA/nanosheet)Background in DTCO and product-driven technology optimizationFamiliarity with automotive-grade qualification (AEC-Q100) or high-reliability applicationsPrior leadership of technology transfer or high-volume manufacturing rampExperience influencing foundry roadmaps or joint development programsLeadership & Behavioral CompetenciesDemonstrated ability to lead through influence (internal and external)Strong technical judgment and decision-making under ambiguityAbility to translate deep technical insights into business-relevant outcomesExcellent communication skills across engineering and executive audiencesProven track record of mentoring and scaling technical teamsImpact of the RoleDirect ownership of device technology success at advanced nodesHigh visibility role with foundry partners in Hsinchu ecosystemSignificant influence on product competitiveness, cost, and manufacturabilityOpportunity to shape next-generation semiconductor platformsMore information about NXP in Greater China...#LI-7743