Wire bond process tech
NXP Semiconductors
Wire bond process tech
Job Description
Key Responsibilities:1.Perform wire bond process task on quality hold material2.Collaborate with engineering to improve WB processes and techniques.3.Assist in resolving WB-related issues to minimize production downtime.Requirements:1.Diploma or above in Engineering or a related field.2.Working experience with WB process is preferable and recommended3.Strong attention to detail and technical troubleshooting skills.#LI-DNI
Locations
- Kuala Lumpur
Skills Required
- WB process is preferableintermediate
Required Qualifications
- 1.Diploma or above in Engineering or a related field. (experience)
- 2.Working experience with WB process is preferable and recommended (experience)
- 3.Strong attention to detail and technical troubleshooting skills. (experience)
Responsibilities
- 1.Perform wire bond process task on quality hold material
- 2.Collaborate with engineering to improve WB processes and techniques.
- 3.Assist in resolving WB-related issues to minimize production downtime.
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