We are building Terafab, a vertically integrated semiconductor factory at an unprecedented scale. The facility houses logic, memory, packaging, test, and lithography mask production under one roof, optimized for rapid iteration and maximum compute density per square foot. Process engineering is where Terafab technology gets built, atom by atom, and metal films determine device speed and reliability. You will develop and own metal deposition processes across three distinct chip families: edge-inference processors, space-hardened chips for orbital satellites, and high-bandwidth memory. You'll control resistivity, adhesion, and step coverage while managing electromigration, stress, and interface quality across diverse thermal and mechanical environments.You should have deep expertise in metal deposition, but be ready to work across core process domains such as plating, etch, and metrology as integration evolves. This is a highly hands-on role at one of the most ambitious fab programs in the world.Responsibilities:Develop and qualify ALD, CVD, and PVD processes for metal gate, work function metals, barrier layers, seed layers, and local interconnect (Co, Ru, W, TiN, TaN) at 2nm-class nodesCharacterize metal film properties—resistivity, conformality, step coverage, grain structure, and adhesion—using XRF, four-point probe, XRD, TEM, and SIMSEvaluate novel metal materials including Ru and Co local interconnect and backside power delivery network (BSPDN) metallization schemesQualify deposition tools from installation through production readiness, including chamber matching, target management, and process window qualificationAnalyze processes from a first-principles, physics-based approach to understand and manipulate mechanisms, not just recipesLead root cause analysis, establish inline metrology and SPC control strategies, and drive systematic yield improvementSupport 24/7 manufacturing operations through rotations, on-call availability, and rapid response to critical production issuesDrive next-generation metal materials and process developmentRequirements:BS or MS in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related technical field5+ years of hands-on thin films process engineering experience in a semiconductor fab, especially <7nm in a logic, memory, or foundry environmentDeep experience with ALD/CVD/PVD tool qualification (Applied Materials, Lam, or Tokyo Electron), metal deposition process development, and process of record (POR) establishment at advanced nodesProficiency with metal films metrology tools: four-point probe, XRF, XRD, TEM, SIMS, film stress measurement, and defect inspectionStrong DOE skills and statistical analysis capability (JMP, Python, or R)Ability to work closely and proactively across lithography, etch, thin films, integration, and equipment engineering teams