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Staff Power Integrity Engineer, Korea

Tesla

Staff Power Integrity Engineer, Korea

full-timePosted: Jul 21, 2026Updated: Aug 26, 2026Seoul, Korea

Job Description

About the job We are seeking a highly skilled Senior or Staff Power Integrity Engineer to lead the design, simulation, and validation of advanced Power Delivery Networks (PDNs) for our next-generation AI chips, packages and systems for Tesla’s Robotaxi, Optimus and data center. This critical role owns the integrity of high-current power delivery from the voltage regulator output down to the SoC, ensuring minimal noise, and superior power efficiency. What You'll Do Architect and optimize low-impedance PDNs, including VRMs, PCB planes, and pcb/package-level decoupling strategies, to meet strict target impedance and voltage droop specifications.Perform 3D/2D electromagnetic simulation, DC IR drop, AC impedance, and transient analysis using industry-standard tools (Ansys SIwave/HFSS, Cadence Sigrity/PowerSI).Collaborate closely with SoC design, package, and PCB layout teams to influence stack-up, ballmaps, and routing guidelines to achieve first-pass silicon success.Define PI test patterns and validation items. Lead lab bring-up, measurement, and debugging of PI issues. Correlate simulation models with measurements using VNAs, Oscilloscopes.Develop and standardize automated simulation workflows and reporting pipelines (Python, MATLAB, or TCL) .Act as the design owner, mentor junior engineers, and drive technical decisions across cross-functional teams What You'll Bring 5+ years of relevant industry experience in Power Integrity, Power Delivery Network (PDN) design, or related field.Deep understanding of EM theory, transmission line theory, and DC/AC circuit analysis.Proficient in EDA tools such as Ansys (HFSS, SIwave, Q3D), Cadence (Sigrity PowerSI/PowerDC), or Keysight ADS.Hands-on experience with high-speed instruments such as VNA, Oscilloscopes, or TDR.Background in advanced IC packaging technologies (including 2.5D/3D integration, silicon interposers, and chiplets), on-chip IR analysis, signal integrity preferred.Degree in Engineering, Computer Science, or equivalent in experience and evidence of exceptional ability

Locations

  • Seoul, Korea

Skills Required

  • Power Integrityintermediate
  • EDA tools such as Ansysintermediate
  • high-speed instruments such as VNAintermediate
  • advanced IC packaging technologiesintermediate

Required Qualifications

  • 5+ years of relevant industry experience in Power Integrity, Power Delivery Network (PDN) design, or related field. (experience, 5 years)
  • Deep understanding of EM theory, transmission line theory, and DC/AC circuit analysis. (experience)
  • Proficient in EDA tools such as Ansys (HFSS, SIwave, Q3D), Cadence (Sigrity PowerSI/PowerDC), or Keysight ADS. (experience)
  • Hands-on experience with high-speed instruments such as VNA, Oscilloscopes, or TDR. (experience)
  • Background in advanced IC packaging technologies (including 2.5D/3D integration, silicon interposers, and chiplets), on-chip IR analysis, signal integrity preferred. (experience)
  • Degree in Engineering, Computer Science, or equivalent in experience and evidence of exceptional ability (experience)

Responsibilities

  • Architect and optimize low-impedance PDNs, including VRMs, PCB planes, and pcb/package-level decoupling strategies, to meet strict target impedance and voltage droop specifications.
  • Perform 3D/2D electromagnetic simulation, DC IR drop, AC impedance, and transient analysis using industry-standard tools (Ansys SIwave/HFSS, Cadence Sigrity/PowerSI).
  • Collaborate closely with SoC design, package, and PCB layout teams to influence stack-up, ballmaps, and routing guidelines to achieve first-pass silicon success.
  • Define PI test patterns and validation items. Lead lab bring-up, measurement, and debugging of PI issues. Correlate simulation models with measurements using VNAs, Oscilloscopes.
  • Develop and standardize automated simulation workflows and reporting pipelines (Python, MATLAB, or TCL) .
  • Act as the design owner, mentor junior engineers, and drive technical decisions across cross-functional teams

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