Work ScheduleStandard (Mon-Fri)Environmental ConditionsOfficeJob DescriptionAt Thermo Fisher Scientific, our Electron Microscopy business is helping the world’s leading semiconductor companies solve some of the industry’s most complex challenges. As semiconductor architectures continue to evolve through advanced packaging, heterogeneous integration, hybrid bonding, and high-bandwidth memory, we’re looking for a strategic technology leader to help define what’s next.As a Key Account Technologist (Advanced Packaging), you’ll work at the intersection of customer technology roadmaps, market strategy, and product innovation. This is a highly visible role where you’ll partner with strategic semiconductor customers and internal business leaders to identify emerging technology trends, understand future workflow challenges, and influence the direction of our electron microscopy portfolio.If you enjoy combining deep semiconductor expertise with strategic thinking and customer engagement, this role offers the opportunity to make a lasting impact on the future of advanced semiconductor manufacturing.What You’ll DoDevelop a deep understanding of advanced semiconductor packaging trends, emerging manufacturing technologies, and customer roadmaps.Build trusted relationships with strategic semiconductor customers to understand future technical challenges and evolving workflow requirements.Translate customer insights and market trends into actionable recommendations for product management, marketing, engineering, and business leadership.Identify technology gaps, competitive opportunities, and innovation priorities that influence future product development.Collaborate across product management, field applications, sales, marketing, and executive leadership to align business strategy with market needs.Communicate complex technical concepts and market insights to diverse audiences, from engineering teams to senior executives.Support strategic account planning by providing technical market intelligence and identifying opportunities to strengthen customer partnerships.Contribute to innovation initiatives, including new workflow concepts, invention disclosures, and long-term portfolio planning.What You’ll BringWe’re looking for someone who combines strong technical credibility with exceptional business insight and communication skills.Minimum RequirementsBachelor’s degree in Engineering, Materials Science, Physics, Electrical Engineering, or a related technical discipline. Advanced degree preferred.8+ years’ experience within the semiconductor industry, preferably supporting advanced packaging technologies.Strong understanding of semiconductor technology roadmaps and next-generation packaging trends, including areas such as:Heterogeneous IntegrationHybrid BondingHigh Bandwidth Memory (HBM)ChipletsDie-to-Wafer and Wafer-to-Wafer IntegrationPhotonicsExperience engaging directly with strategic semiconductor customers or technology partners.Ability to synthesize technical information into strategic business recommendations.Excellent presentation and executive communication skills.Proven success influencing cross-functional teams in a matrixed organization.Preferred ExperienceExperience in one or more of the following areas is highly desirable:Semiconductor equipment manufacturingSemiconductor device manufacturers or foundriesAdvanced packaging organizationsFailure analysisProcess integrationYield engineeringMetrologyApplications engineeringTechnical marketingProduct strategyStrategic account technology leadership